The TS3A24157 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 3.6 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transfer of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance and consumes very-low power. These features make this device suitable for portable audio applications.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TS3A24157 0.65-Ω 2-Channel SPDT Analog Switch 2-Channel 2:1 Multiplexer and Demultiplexer datasheet (Rev. B) | PDF | HTML | 12 Oct 2016 |
| Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 26 Jul 2022 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 Jun 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 Dec 2021 | |
| Application note | Preventing Excess Power Consumption on Analog Switches | 03 Jul 2008 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 Jul 2004 |
For additional terms or required resources, click any title below to view the detail page where available.
The AWRL6844EVM from Texas Instruments is an easy-to-use evaluation board for the AWRL6844 automotive mmWave radar sensor, with standalone operation and has direct connectivity to the DCA1000EVM for raw ADC capture and signal processing development. This EVM contains everything required to start (...)
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| UQFN (RSE) | 10 | Ultra Librarian |
| VSSOP (DGS) | 10 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.