AM68A

Processor cores:

• Up to dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2 GHz
  • 1MB shared L2 cache per dual-core Cortex-A72 cluster
  • 32KB L1 D-Cache and 48KB L1 I-Cache per Cortex-A72 core
• Deep Learning Accelerator:
  • Up to 8 Trillion Operations Per Second (TOPS)
• Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
• Dual-core Arm Cortex-R5F MCUs at up to 1.0 GHz in General Compute partition with FFI
  • 16KB L1 D-Cache, 16KB L1 I-Cache, and 64KB L2 TCM
• Dual-core Arm® Cortex®-R5F MCUs at up to 1.0 GHz to support Device Management
  • 32K L1 D-Cache, 32K I-Cache, and 64K L2 TCM with SECDED ECC on all memories
• Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • 480 MPixel/s ISP
  • Support for up to 16-bit input RAW format
  • Wide Dynamic Range (WDR), Lens Distortion Correction (LDC), Vision Imaging Subsystem (VISS), and Multi-Scalar (MSC) support
  • Output color format : 8-bits, 12-bits, and YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL

Multimedia:

• Display subsystem supports:
  • Up to 4 displays
  • Up to two DSI 4L TX (up to 2.5K)
  • One eDP 4L
  • One DPI 24-bit RGB parallel interface
  • OLDI/LVDS (4 lanes - 2x) and 24-bit RGB parallel interface
  • Safety features such as freeze frame detection and MISR data check
• 3D Graphics Processing Unit
  • IMG BXS-4-64, up to 800 MHz
  • 50 GFLOPS, 4 GTexels/s
  • >500 MTexels/s, >8 GFLOPs
  • Supports at least 2 composition layers
  • Supports up to 2048x1080 @60fps
  • Supports ARGB32, RGB565 and YUV formats
  • 2D graphics capable
  • OpenGL ES 3.1, Vulkan 1.2
• Two CSI2.0 4L Camera Serial interface (CSI-Rx) Plus CSI2.- 4L Tx (CSI-Tx) with DPHY
  • MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
  • Support for 1,2,3, or 4 data lane mode up to 1.5Gbps
  • ECC verification/correction with CRC check + ECC on RAM
  • Virtual Channel support (up to 16)
  • Ability to write stream data directly to DDR via DMA
• Video Encoder/Decoder
  • Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
  • Support for H.264 BaseLine/Main/High Profiles at Level 5.2
  • Support for up to 4K UHD resolution (3840 × 2160)
  • 4K60 H.264/H.265 Encode/Decode (up to 480 MP/s)

Memory subsystem:

• Up to 4MB of on-chip L3 RAM with ECC and coherency
  • ECC error protection
  • Shared coherent cache
  • Supports internal DMA engine
• Up to two External Memory Interface (EMIF) modules with ECC
  • Supports LPDDR4 memory types
  • Supports speeds up to 4266 MT/s
  • Up to two 32-bit data bus with inline ECC up to 17 GB/s per EMIF
• General-Purpose Memory Controller (GPMC)
• Up to two 512KB on-chip SRAM in MAIN domain, protected by ECC

Device security:

• Secure boot with secure run-time support
• Customer programmable root key, up to RSA-4K or ECC-512
• Embedded hardware security module
• Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES

High speed serial interfaces:

• One PCI-Express (PCIe) Gen3 controllers
  • Up to four lanes per controller
  • Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
• One USB 3.0 dual-role device (DRD) subsystem
  • Enhanced SuperSpeed Gen1 Port
  • Supports Type-C switching
  • Independently configurable as USB host, USB peripheral, or USB DRD
• Two CSI2.0 4L RX plus Two CSI2.04L TX
• Two Ethernet RMII/RGMII interfaces

Flash memory interfaces:

• Embedded MultiMediaCard Interface (eMMC™ 5.1)
• One Secure Digital 3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
• Two simultaneous flash interfaces configured as
  • One OSPI or HyperBus™ or QSPI, and
  • One QSPI

Technology / Package:

• 16-nm FinFET technology
• 23 mm x 23 mm, 0.8-mm pitch, 770-pin FCBGA (ALZ)