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CSD95430

AKTIV

Intelligente NexFET™-Leistungsstufe für synchronen Abwärtswandler mit bis zu 90 A

Produktdetails

VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -40 to 125
VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -40 to 125
VQFN-CLIP (RRB) 41 30 mm² 6 x 5
  • Active current balancing between paralleled phases sharing a single PWM input
  • Peak continuous current: 90-A
  • System efficiency: > 95% at 30-A
  • High-frequency operation: 1.25-MHz
  • Diode emulation function to enable efficiency discontinuous conduction mode (DCM) operation
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • PWM signal compatible: 3.3 V and 5 V
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density industry common QFN 5-mm x 6-mm footprint
  • Ultra-low inductance package
  • System-optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant - lead-free terminal plating
  • Halogen free
  • Active current balancing between paralleled phases sharing a single PWM input
  • Peak continuous current: 90-A
  • System efficiency: > 95% at 30-A
  • High-frequency operation: 1.25-MHz
  • Diode emulation function to enable efficiency discontinuous conduction mode (DCM) operation
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • PWM signal compatible: 3.3 V and 5 V
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density industry common QFN 5-mm x 6-mm footprint
  • Ultra-low inductance package
  • System-optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant - lead-free terminal plating
  • Halogen free

The CSD95430RRBNexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. This power stage features an active current balance feature which allows multiple power stages to be paralleled off a single PWM input. This enables phase multiplication for very high current applications without the need for a similarly high phase count controller. The active current balance ensures that the multiplied phases share current evenly so no significant derating of current capability is needed when paralleling phases.

The CSD95430RRBNexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. This power stage features an active current balance feature which allows multiple power stages to be paralleled off a single PWM input. This enables phase multiplication for very high current applications without the need for a similarly high phase count controller. The active current balance ensures that the multiplied phases share current evenly so no significant derating of current capability is needed when paralleling phases.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet CSD95430RRB Synchronous Buck NexFET™ Smart Power Stage datasheet PDF | HTML 20 Dez 2022

Design und Entwicklung

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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN-CLIP (RRB) 41 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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