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CSD97395Q4M

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CSD97395Q4M Hochfrequenz-Synchron-Buck-NexFET™-Leistungsstufe

Produktdetails

VDS (V) 30 Ploss current (A) 15 Rating Catalog Operating temperature range (°C) -40 to 150
VDS (V) 30 Ploss current (A) 15 Rating Catalog Operating temperature range (°C) -40 to 150
VSON-CLIP (DPC) 8 15.75 mm² 4.5 x 3.5
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 mm × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode With FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 mm × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode With FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free

The CSD97395Q4M NexFET7trade; Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97395Q4M NexFET7trade; Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet CSD97395Q4M Synchronous Buck NexFET Power Stage datasheet (Rev. A) PDF | HTML 31 Mär 2015
Technical article How to create a power supply for Intel’s Braswell processor PDF | HTML 10 Aug 2015

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

CSD97395Q4M PSpice Transient Model

SLPM279.ZIP (56 KB) - PSpice Model
Simulationsmodell

CSD97395Q4M TINA-TI Reference Design

SLPM278.TSC (316 KB) - TINA-TI Reference Design
Simulationsmodell

CSD97395Q4M TINA-TI Transient Spice Model

SLPM280.ZIP (53 KB) - TINA-TI Spice Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VSON-CLIP (DPC) 8 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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