Produktdetails

Rating Automotive Integrated isolated power No Isolation rating Reinforced Number of channels 3 Forward/reverse channels 2 forward / 1 reverse Default output High, Low Data rate (max) (Mbps) 50 Surge isolation voltage (VIOSM) (VPK) 10000 Transient isolation voltage (VIOTM) (VPK) 7071 Withstand isolation voltage (VISO) (Vrms) 5000 CMTI (min) (V/µs) 100000 Operating temperature range (°C) -40 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 1.71 Propagation delay time (typ) (µs) 0.011 Current consumption per channel (DC) (typ) (mA) 1 Current consumption per channel (1 Mbps) (typ) (mA) 1.65 Creepage (min) (mm) 8 Clearance (min) (mm) 8 TI functional safety category Functional Safety-Capable
Rating Automotive Integrated isolated power No Isolation rating Reinforced Number of channels 3 Forward/reverse channels 2 forward / 1 reverse Default output High, Low Data rate (max) (Mbps) 50 Surge isolation voltage (VIOSM) (VPK) 10000 Transient isolation voltage (VIOTM) (VPK) 7071 Withstand isolation voltage (VISO) (Vrms) 5000 CMTI (min) (V/µs) 100000 Operating temperature range (°C) -40 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 1.71 Propagation delay time (typ) (µs) 0.011 Current consumption per channel (DC) (typ) (mA) 1 Current consumption per channel (1 Mbps) (typ) (mA) 1.65 Creepage (min) (mm) 8 Clearance (min) (mm) 8 TI functional safety category Functional Safety-Capable
SOIC (DW) 16 106.09 mm² 10.3 x 10.3
  • Functional Safety-Capable
    • Documentation available to aid functional safety system design: ISO6731-Q1
  • AEC-Q100 qualified with the following results:
    • Device temperature Grade 1: –40°C to +125°C ambient operating temperature range
  • Meets VDA320 isolation requirements
  • 50 Mbps data rate
  • Robust isolation barrier:
    • High lifetime at 1500 VRMS working voltage
    • Up to 5000 VRMS isolation rating
    • Up to 10 kV surge capability
    • ±75 kV/µs typical CMTI
  • Wide supply range: 1.71 V to 1.89 V and 2.25 V to 5.5 V
  • 1.71 V to 5.5 V level translation
  • Default output high (ISO6731-Q1) and low (ISO6731F-Q1) options
  • 1.6 mA per channel typical at 1 Mbps
  • Low propagation delay: 11 ns typical
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16) Package
  • Safety-Related Certifications:
    • DIN VDE V 0884-11:2017-01
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1
    • GB 4943.1-2011 certifications (pending)
  • Functional Safety-Capable
    • Documentation available to aid functional safety system design: ISO6731-Q1
  • AEC-Q100 qualified with the following results:
    • Device temperature Grade 1: –40°C to +125°C ambient operating temperature range
  • Meets VDA320 isolation requirements
  • 50 Mbps data rate
  • Robust isolation barrier:
    • High lifetime at 1500 VRMS working voltage
    • Up to 5000 VRMS isolation rating
    • Up to 10 kV surge capability
    • ±75 kV/µs typical CMTI
  • Wide supply range: 1.71 V to 1.89 V and 2.25 V to 5.5 V
  • 1.71 V to 5.5 V level translation
  • Default output high (ISO6731-Q1) and low (ISO6731F-Q1) options
  • 1.6 mA per channel typical at 1 Mbps
  • Low propagation delay: 11 ns typical
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16) Package
  • Safety-Related Certifications:
    • DIN VDE V 0884-11:2017-01
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1
    • GB 4943.1-2011 certifications (pending)

The ISO6731-Q1 device is a high-performance, triple-channel digital isolators ideal for cost-sensitive applications requiring up to 5000 VRMS isolation ratings per UL 1577. This device is also certified by VDE, TUV, CSA, and CQC.

The ISO6731-Q1 devics provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications. The ISO6731-Q1 device has two forward and one reverse-direction channels. In the event of input power or signal loss, the default output is high for the device without suffix F and low for the device with suffix F. See Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6731-Q1 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO6731-Q1 device is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.

The ISO6731-Q1 device is a high-performance, triple-channel digital isolators ideal for cost-sensitive applications requiring up to 5000 VRMS isolation ratings per UL 1577. This device is also certified by VDE, TUV, CSA, and CQC.

The ISO6731-Q1 devics provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications. The ISO6731-Q1 device has two forward and one reverse-direction channels. In the event of input power or signal loss, the default output is high for the device without suffix F and low for the device with suffix F. See Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6731-Q1 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO6731-Q1 device is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Drop-In-Ersatz mit verbesserter Funktionalität im Gegensatz zum verglichenen Baustein
ISO7731-Q1 AKTIV Dreikanaliger, verstärkter Digitalisolator, 2/1, mit stabilem EMV-Verhalten, für die Automobilindust Pin-to-pin upgrade with higher performance

Technische Dokumentation

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

DIGI-ISO-EVM — Evaluierungsmodul für universellen digitalen Isolator

DIGI-ISO-EVM ist ein Evaluierungsmodul (EVM), mit dem Sie alle ein-, zwei-, drei-, vier- oder sechskanaligen digitalen Isolatoren von TI in fünf verschiedenen Gehäusen evaluieren können: 8-poliges SOIC mit schmalem Gehäuse (D), 8-poliges SOIC mit breitem Gehäuse (DWV), 16-poliges SOIC mit breitem (...)

Benutzerhandbuch: PDF | HTML
Evaluierungsplatine

ISO6741DWEVM — ISO67xx Evaluierungsmodul für universellen, dreikanaligen oder vierkanaligen digitalen Isolator

ISO6741DWEVM is an evaluation module used to evaluate the low speed, general purpose, triple- or quad channel-digital isolator ISO67xx in 16-Pin WB SOIC package (package code-DW). The EVM features enough test points and jumper options for one to evaluate the device with minimal external components.
Benutzerhandbuch: PDF | HTML
Simulationsmodell

ISO6731 PSpice Transient Model

SLLM483.ZIP (887 KB) - PSpice Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
SOIC (DW) 16 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos