NEU

LSF0002

AKTIV

Extrem kleiner automatischer bidirektionaler Umsetzer für Open-Drain- und Push-Pull-Anwendungen

Produktdetails

Technology family LSF Applications GPIO, I2C, MDIO, PMBus, SMBus Bits (#) 2 Data rate (max) (Mbps) 200 High input voltage (min) (V) 0.95 High input voltage (max) (V) 5 Vout (min) (V) 0.95 Vout (max) (V) 5 Supply current (max) (µA) 12.5 Features Output enable Input type Transmission Gate Output type 3-State, Transmission Gate Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LSF Applications GPIO, I2C, MDIO, PMBus, SMBus Bits (#) 2 Data rate (max) (Mbps) 200 High input voltage (min) (V) 0.95 High input voltage (max) (V) 5 Vout (min) (V) 0.95 Vout (max) (V) 5 Supply current (max) (µA) 12.5 Features Output enable Input type Transmission Gate Output type 3-State, Transmission Gate Rating Catalog Operating temperature range (°C) -40 to 125
X2SON (DTQ) 6 0.8 mm² 1 x 0.8
  • Provides bidirectional voltage translation with no direction pin
  • Supports up to 100MHz up translation and greater than 100MHz down translation at ≤ 30pF capacitive load and up To 40MHz up or down translation at 50pF capacitive load
  • Allows bidirectional voltage-level translation between
    • 0.95V ↔ 1.8/2.5/3.3/5V
    • 1.2V ↔ 1.8/2.5/3.3/5V
    • 1.8V ↔ 2.5/3.3/5V
    • 2.5V ↔ 3.3/5V
    • 3.3V ↔ 5V
  • Low standby current
  • 5V tolerance I/O port to support TTL
  • Low RON provides less signal distortion
  • High-impedance I/O pins for EN = Low
  • Flow-through pinout for easy PCB trace routing
  • Latch-up performance >100mA per JESD 17
  • –40°C to 125°C operating temperature range
  • Provides bidirectional voltage translation with no direction pin
  • Supports up to 100MHz up translation and greater than 100MHz down translation at ≤ 30pF capacitive load and up To 40MHz up or down translation at 50pF capacitive load
  • Allows bidirectional voltage-level translation between
    • 0.95V ↔ 1.8/2.5/3.3/5V
    • 1.2V ↔ 1.8/2.5/3.3/5V
    • 1.8V ↔ 2.5/3.3/5V
    • 2.5V ↔ 3.3/5V
    • 3.3V ↔ 5V
  • Low standby current
  • 5V tolerance I/O port to support TTL
  • Low RON provides less signal distortion
  • High-impedance I/O pins for EN = Low
  • Flow-through pinout for easy PCB trace routing
  • Latch-up performance >100mA per JESD 17
  • –40°C to 125°C operating temperature range

The LSF0002 supports bidirectional voltage translation without the need for DIR pin, which minimizes system effort (for PMBus, I2C, SMBus, and so forth). The LSF family of devices supports up to 100MHz up translation and greater than 100MHz down translation at ≤ 30pF capacitive load and up to 40MHz up or down translation at 50pF capacitive load, which allows the LSF family to support more consumer or telecom interfaces (MDIO or SDIO).

LSF family supports 5V tolerance on I/O port, which makes it compatible with TTL levels in industrial and telecom applications. The LSF family can set up different voltage translation levels, which makes it very flexible.

Unlike the LSF0x0x family, the LSF0002 does not require VREF_A and VREF_B power supplies and the 200kΩ bias resistor. The LSF0002 utilizes the VBIAS pin that enables translation by being biased to the same voltage as the lower power supply at the I/Os that is being translated to and from.

The LSF0002 supports bidirectional voltage translation without the need for DIR pin, which minimizes system effort (for PMBus, I2C, SMBus, and so forth). The LSF family of devices supports up to 100MHz up translation and greater than 100MHz down translation at ≤ 30pF capacitive load and up to 40MHz up or down translation at 50pF capacitive load, which allows the LSF family to support more consumer or telecom interfaces (MDIO or SDIO).

LSF family supports 5V tolerance on I/O port, which makes it compatible with TTL levels in industrial and telecom applications. The LSF family can set up different voltage translation levels, which makes it very flexible.

Unlike the LSF0x0x family, the LSF0002 does not require VREF_A and VREF_B power supplies and the 200kΩ bias resistor. The LSF0002 utilizes the VBIAS pin that enables translation by being biased to the same voltage as the lower power supply at the I/Os that is being translated to and from.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 1
Typ Titel Datum
* Data sheet LSF0002 Ultra-Small Auto-Bidirectional Translator for Open Drain or Push Pull Applications datasheet PDF | HTML 11 Apr 2024

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

5-8-LOGIC-EVM — Generisches Logik-Evaluierungsmodul für 5- bis 8-polige DCK-, DCT-, DCU-, DRL- und DBV-Gehäuse

Flexibles EVM zur Unterstützung aller Geräte mit 5- bis 8-poligem DCK-, DCT-, DCU-, DRL- oder DBV-Gehäuse.
Benutzerhandbuch: PDF
Evaluierungsplatine

LSF-EVM — 1 bis 8-Bit LSF-Übersetzerfamilie – Evaluierungsmodul

The LSF family of devices are level translators that support a voltage range of 0.95V and 5V and provide multi-voltage bidirectional translation without a direction pin.

The LSF-EVM comes populated with the LSF0108PWR device and has landing patterns that are compatible with the LSF0101DRYR, (...)

Benutzerhandbuch: PDF
Simulationsmodell

LSF0002 IBIS Model

SDLM076.ZIP (56 KB) - IBIS Model
Referenzdesigns

TIDA-01012 — Drahtloses IoT, Bluetooth® niederenergetisch, 4½-stellig, 100-kHz-True-RMS-Digital-Multimeter

Many products are now becoming connected through the Internet of Things (IoT), including test equipment such as digital multimeters (DMM).  Enabled by Texas Instruments’ SimpleLink™ ultra-low power wireless microcontroller (MCU) platform, the TIDA-01012 reference design (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-01014 — Referenzdesign für Akkuladeanzeige mit erhöhter Genauigkeit für industrielle IoT-Feldmessungen mit g

The Internet of Things (IoT) revolution is efficiently connecting applications and instruments, enabling battery powered, wide scale very low power sensor deployment.  New technologies, such as TI’s advanced sensor and low power connectivity devices, are enabling these instruments to be (...)
Design guide: PDF
Schaltplan: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
X2SON (DTQ) 6 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos