Produktdetails

Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type CMOS Output type CMOS Features Balanced outputs, Positive input clamp diode, Very high speed (tpd 5-10ns) Technology family AC Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type CMOS Output type CMOS Features Balanced outputs, Positive input clamp diode, Very high speed (tpd 5-10ns) Technology family AC Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 85
SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 2-V to 6-V VCC Operation
  • Inputs Accept Voltages to 6 V
  • Max tpd of 7 ns at 5 V

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 2-V to 6-V VCC Operation
  • Inputs Accept Voltages to 6 V
  • Max tpd of 7 ns at 5 V

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74AC245 octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

When the output-enable (OE)\ is low, the device passes noninverted data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction control (DIR) input. A high on OE\ disables the device so that the buses are effectively isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74AC245 octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

When the output-enable (OE)\ is low, the device passes noninverted data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction control (DIR) input. A high on OE\ disables the device so that the buses are effectively isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet SN74AC245-EP datasheet 28 Sep 2004
* VID SN74AC245-EP VID V6204760 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
More literature HiRel Unitrode Power Management Brochure 07 Jul 2009
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design und Entwicklung

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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
SOIC (DW) 20 Ultra Librarian

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  • Kontinuierliches Zuverlässigkeitsmonitoring
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