SN74HC10-EP

AKTIV

Enhanced product 3-ch, 3-input, 2-V to 6-V 5.2 mA drive strength NAND gate

Produktdetails

Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 3 Inputs per channel 3 IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Input type Standard CMOS Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 28 Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
Technology family HC Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 3 Inputs per channel 3 IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Input type Standard CMOS Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 28 Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Wide Operating Voltage Range of 2 V to 6 V
  • Outputs Can Drive Up To 10 LSTTL Loads
  • Low Power Consumption, 20-µA Max ICC
  • Typical tpd = 9 ns
  • ±4-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Wide Operating Voltage Range of 2 V to 6 V
  • Outputs Can Drive Up To 10 LSTTL Loads
  • Low Power Consumption, 20-µA Max ICC
  • Typical tpd = 9 ns
  • ±4-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74HC10 device contains three independent 3-input NAND gates. It performs the Boolean function Y = (A • B • C)\ or Y = A\ + B\ + C\ in positive logic.

The SN74HC10 device contains three independent 3-input NAND gates. It performs the Boolean function Y = (A • B • C)\ or Y = A\ + B\ + C\ in positive logic.

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Technische Dokumentation

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Alle anzeigen 15
Typ Titel Datum
* Data sheet SN74HC10-EP datasheet 06 Jan 2004
* VID SN74HC10-EP VID V6204688 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 Mai 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design und Entwicklung

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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
SOIC (D) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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