Startseite Energiemanagement Mehrkanal-ICs (PMICs)

TPS53317

AKTIV

Synchroner Abwärtswandler SWIFT™, niedrige Eingangsspannung, 6 A, DDR-Speicherabschluss

Produktdetails

Vin (min) (V) 1 Vin (max) (V) 6 Vout (min) (V) -0.3 Vout (max) (V) 3.6 Features Complete Solution Rating Catalog Operating temperature range (°C) -40 to 85 Iq (typ) (mA) 0.32 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L, DDR4, LPDDR2, LPDDR3
Vin (min) (V) 1 Vin (max) (V) 6 Vout (min) (V) -0.3 Vout (max) (V) 3.6 Features Complete Solution Rating Catalog Operating temperature range (°C) -40 to 85 Iq (typ) (mA) 0.32 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L, DDR4, LPDDR2, LPDDR3
VQFN (RGB) 20 14 mm² 4 x 3.5
  • TI proprietary Integrated MOSFET and Packaging Technology
  • Supports DDR Memory Termination with up to 6-A Continuous Output Source or Sink Current
  • External Tracking
  • Minimum External Components Count
  • to 6-V Conversion Voltage
  • D-CAP+ Mode Architecture
  • Supports All MLCC Output Capacitors and SP/POSCAP
  • Selectable SKIP Mode or Forced CCM
  • Optimized Efficiency at Light and Heavy Loads
  • Selectable 600-kHz or 1-MHz Switching Frequency
  • Selectable Overcurrent Limit (OCL)
  • Overvoltage, Over-Temperature and Hiccup Undervoltage Protection
  • Adjustable Output Voltage from to 2 V
  • 3.5 mm × 4 mm, 20-Pin VQFN Package
  • TI proprietary Integrated MOSFET and Packaging Technology
  • Supports DDR Memory Termination with up to 6-A Continuous Output Source or Sink Current
  • External Tracking
  • Minimum External Components Count
  • to 6-V Conversion Voltage
  • D-CAP+ Mode Architecture
  • Supports All MLCC Output Capacitors and SP/POSCAP
  • Selectable SKIP Mode or Forced CCM
  • Optimized Efficiency at Light and Heavy Loads
  • Selectable 600-kHz or 1-MHz Switching Frequency
  • Selectable Overcurrent Limit (OCL)
  • Overvoltage, Over-Temperature and Hiccup Undervoltage Protection
  • Adjustable Output Voltage from to 2 V
  • 3.5 mm × 4 mm, 20-Pin VQFN Package

The device is a FET-integrated synchronous buck regulator designed mainly for DDR termination. It can provide a regulated output at ½ VDDQ with bothsink and source capability. The device employs D-CAP+ mode operation that provides ease of use, low external componentcount and fast transient response. The device can also be used for other point-of-load (POL)regulation applications requiring up to 6 A. In addition, the device supports full, 6-A, outputsinking current capability with tight voltage regulation.

The device features two switching frequency settings (600 kHz and 1 MHz), integrateddroop support, external tracking capability, pre-bias startup, output soft discharge, integratedbootstrap switch, power good function, V5IN pin UVLO protection, and supports both ceramic andSP/POSCAP capacitors. It supports input voltages up to 6.0 V, and output voltages adjustable from to 2.0 V.

The device is available in the 3.5 mm × 4 mm, 20-pin, VQFNpackage (Green RoHs compliant and Pb free) with TI proprietary Integrated MOSFET and packaging technology and is specified from –40°C to 85°C.

For all available packages, see the orderable addendum at the end of the data sheet.

The device is a FET-integrated synchronous buck regulator designed mainly for DDR termination. It can provide a regulated output at ½ VDDQ with bothsink and source capability. The device employs D-CAP+ mode operation that provides ease of use, low external componentcount and fast transient response. The device can also be used for other point-of-load (POL)regulation applications requiring up to 6 A. In addition, the device supports full, 6-A, outputsinking current capability with tight voltage regulation.

The device features two switching frequency settings (600 kHz and 1 MHz), integrateddroop support, external tracking capability, pre-bias startup, output soft discharge, integratedbootstrap switch, power good function, V5IN pin UVLO protection, and supports both ceramic andSP/POSCAP capacitors. It supports input voltages up to 6.0 V, and output voltages adjustable from to 2.0 V.

The device is available in the 3.5 mm × 4 mm, 20-pin, VQFNpackage (Green RoHs compliant and Pb free) with TI proprietary Integrated MOSFET and packaging technology and is specified from –40°C to 85°C.

For all available packages, see the orderable addendum at the end of the data sheet.

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Technische Dokumentation

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Alle anzeigen 4
Typ Titel Datum
* Data sheet TPS53317 6-A Output, D-CAP+ Mode, Synchronous Step-Down, Integrated-FET Converter for DDR Memory Termination datasheet (Rev. D) PDF | HTML 10 Jul 2015
Selection guide SWIFT DC/DC Converters Selector Guide (Rev. G) 06 Feb 2019
Selection guide Power Management Guide 2018 (Rev. R) 25 Jun 2018
EVM User's guide Using the TPS53317EVM-750 D-CAP+™ Mode Synchronous Step-Down Integrated FETs Con 06 Sep 2011

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

TPS53317 IBIS Model

SLUM347.ZIP (10 KB) - IBIS Model
Simulationsmodell

TPS53317 PSpice Transient Model

SLUM370.ZIP (64 KB) - PSpice Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RGB) 20 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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