Startseite Energiemanagement DC/DC-Spannungsversorgungsmodul Stromversorgungsmodule (integrierter Induktor)
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DC/DC-Spannungsversorgungsmodul
Stromversorgungsmodule (integrierter Induktor)

TPS81256

AKTIV

Integrierte Stromversorgungslösung, 3 W, hocheffizientes Aufwärtswandlermodul, im MicroSiP™-Ge

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Datenblatt

TPS81256

AKTIV
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Produktdetails

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Boost Type Module Iout (max) (A) 0.7 Vin (min) (V) 2.5 Vin (max) (V) 5.5 Vout (min) (V) 5 Vout (max) (V) 5 Features Enable, Input/Output Isolation, Synchronous Rectification
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Boost Type Module Iout (max) (A) 0.7 Vin (min) (V) 2.5 Vin (max) (V) 5.5 Vout (min) (V) 5 Vout (max) (V) 5 Features Enable, Input/Output Isolation, Synchronous Rectification
USIP (SIP) 9 See data sheet
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.
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Technische Dokumentation

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Typ Titel Datum
* Data sheet TPS81256 3-W, High Efficiency Step-Up Converter In MicroSiP Packaging datasheet (Rev. D) PDF | HTML 02 Feb 2018
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 14 Okt 2021
User guide Manufacturing and Rework Design Guide for MicroSiP™ Power Modules (Rev. A) PDF | HTML 16 Jun 2021
Selection guide Power Management Guide 2018 (Rev. R) 25 Jun 2018
EVM User's guide TPS8125xEVM 13 Apr 2012

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TPS81256EVM-121 — Hocheffizienter 3-W-Aufwärtswandler im MicroSiP™-Gehäuse – Evaluierungsmodul

The TPS81256EVM-121 enables test and evaluation of Texas Instruments' TPS81256 devices, a series of 4.5-MHz, step-up DC-DC converters. This user's guide includes EVM specifications, a schematic diagram, a bill of materials, and board layout images. The TPS81256 device is an ideal power-supply (...)

Benutzerhandbuch: PDF
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Simulationsmodell

TPS81256 TINA-TI Transient Reference Design

SLVM726.TSC (115 KB) - TINA-TI Reference Design
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Simulationsmodell

TPS81256 TINA-TI Transient Spice Model

SLVM725.ZIP (52 KB) - TINA-TI Spice Model
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Simulationsmodell

TPS81256 Unencrypted PSpice Transient Model Package (Rev. A)

SLVM607A.ZIP (46 KB) - PSpice Model
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Referenzdesigns

TIDA-00554 — Ultramobiles DLP-NIR-Spektrometer für tragbare chemische Analysegeräte mit Bluetooth-Konnektivität

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
Schaltplan: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
USIP (SIP) 9 Ultra Librarian
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Bestellen & Qualität

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  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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  • Montagestandort

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