TXB0102

AKTIV

Bidirektionaler Spannungspegelumsetzer, 2 Bit, automatischer Richtungserkennung und ESD-Schutz bis +

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Datenblatt

document-pdfAcrobat TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and ±15-kV ESD Protection datasheet (Rev. E) (Englisch) PDF | HTML

TXB0102

AKTIV

Datenblatt

Jetzt bestellen

Produktdetails

Technology family

TXB

Applications

GPIO, SPI, UART

Bits (#)

2

Data rate (max) (Mbps)

100

High input voltage (min) (V)

0.78

High input voltage (max) (V)

5.5

Vout (min) (V)

1.2

Vout (max) (V)

5.5

IOH (max) (mA)

-0.02

IOL (max) (mA)

0.02

Supply current (max) (µA)

8

Features

Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation

Input type

Standard CMOS

Output type

3-State, CMOS, Push-Pull

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Technology family

TXB

Applications

GPIO, SPI, UART

Bits (#)

2

Data rate (max) (Mbps)

100

High input voltage (min) (V)

0.78

High input voltage (max) (V)

5.5

Vout (min) (V)

1.2

Vout (max) (V)

5.5

IOH (max) (mA)

-0.02

IOL (max) (mA)

0.02

Supply current (max) (µA)

8

Features

Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation

Input type

Standard CMOS

Output type

3-State, CMOS, Push-Pull

Rating

Catalog

Operating temperature range (°C)

-40 to 85

DSBGA (YZP)

8

2.8125 mm² 2.25 x 1.25

VSSOP (DCU)

8

6.2 mm² 2 x 3.1

Available in the Texas Instruments NanoFree™ Packages
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On B Port (V CCA ≤ V CCB)
V CC Isolation Feature – If Either V CC Input Is at GND, All Outputs Are in the High-Impedance State
OE Input Circuit Referenced to V CCA
Low Power Consumption, 4-µA Max I CC
I off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
- A Port
  - 2500-V Human-Body Model (A114-B)
  - 200-V Machine Model (A115-A)
  - 1500-V Charged-Device Model (C101)
- B Port
  - 15-kV Human-Body Model (A114-B)
  - 200-V Machine Model (A115-A)
  - 1500-V Charged-Device Model (C101)

Available in the Texas Instruments NanoFree™ Packages
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On B Port (V CCA ≤ V CCB)
V CC Isolation Feature – If Either V CC Input Is at GND, All Outputs Are in the High-Impedance State
OE Input Circuit Referenced to V CCA
Low Power Consumption, 4-µA Max I CC
I off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
- A Port
  - 2500-V Human-Body Model (A114-B)
  - 200-V Machine Model (A115-A)
  - 1500-V Charged-Device Model (C101)
- B Port
  - 15-kV Human-Body Model (A114-B)
  - 200-V Machine Model (A115-A)
  - 1500-V Charged-Device Model (C101)

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA must not exceed V CCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB. V CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V CCA must not exceed V CCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ technology is a major breakthrough in IC packaging concepts, using the die as the package.

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Technische Dokumentation

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	Typ	Titel		Datum
*	Data sheet	TXB0102 2-Bit Bidirectional Voltage-Level Translator With Auto Direction Sensing and ±15-kV ESD Protection datasheet (Rev. E)	PDF \| HTML	17 Okt 2023
	Application note	Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators	PDF \| HTML	12 Jul 2024
	Application note	Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A)	PDF \| HTML	03 Jul 2024
	Application note	Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters	PDF \| HTML	29 Sep 2023
	Application note	Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato	PDF \| HTML	28 Jun 2023
	EVM User's guide	TXB-EVM Evaluation Module User's Guide (Rev. A)	PDF \| HTML	02 Aug 2021
	Selection guide	Voltage Translation Buying Guide (Rev. A)		15 Apr 2021
	Application note	Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A)		28 Mär 2018
	Application note	Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices		19 Nov 2017
	Application note	Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators		30 Okt 2017
	Application note	A Guide to Voltage Translation With TXS-Type Translators		29 Jun 2010
	Application note	A Guide to Voltage Translation With TXB-Type Translators		03 Mär 2010

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

5-8-LOGIC-EVM — Generisches Logik-Evaluierungsmodul für 5- bis 8-polige DCK-, DCT-, DCU-, DRL- und DBV-Gehäuse

Flexibles EVM zur Unterstützung aller Geräte mit 5- bis 8-poligem DCK-, DCT-, DCU-, DRL- oder DBV-Gehäuse.

Benutzerhandbuch: PDF

Nicht verfügbar auf TI.com

Evaluierungsplatine

TXB-EVM — 1 bis 8-Bit TXB-Übersetzerfamilie – Evaluierungsmodul

This EVM is designed to support the TXB auto bidirectional families for single, dual, four and eight channel devices. The TXB devices belong to the auto bidirectional translation family with an operating voltage designed to level translation between 1.2V and 5.5 V.

Benutzerhandbuch: PDF | HTML

Nicht verfügbar auf TI.com

Simulationsmodell

TXB0102 IBIS Model (Rev. A)

SCEM563A.ZIP (71 KB) - IBIS Model

Herunterladen

Referenzdesigns

TIDM-RF430FRLSENSE — RF430FRL152H – Referenzdesign für NFC-Temperatur und -Lichtsensor

This reference design provides a platform to evaluate the RF430FRL152H NFC Sensor Interface Transponder. Directly out of the box, thermistor and photo transistor measurements can be communicated to an NFC enabled smart phone or other NFC/RFID Reader device. This reference design can be (...)

Schaltplan: PDF

Referenzdesigns

TIDA-00403 — Referenzdesign für Entfernungsmessungen per Ultraschall mit dem TLV320AIC3268-miniDSP-Codec

The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed (...)

Design guide: PDF

Schaltplan: PDF

Gehäuse	Pins	CAD-Symbole, Footprints und 3D-Modelle
DSBGA (YZP)	8	Ultra Librarian
VSSOP (DCU)	8	Ultra Librarian

Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

TXB0102

Bidirektionaler Spannungspegelumsetzer, 2 Bit, automatischer Richtungserkennung und ESD-Schutz bis +

TXB0102

Produktdetails

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Technische Dokumentation

Design und Entwicklung

5-8-LOGIC-EVM — Generisches Logik-Evaluierungsmodul für 5- bis 8-polige DCK-, DCT-, DCU-, DRL- und DBV-Gehäuse

TXB-EVM — 1 bis 8-Bit TXB-Übersetzerfamilie – Evaluierungsmodul

TXB0102 IBIS Model (Rev. A)

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TIDA-00403 — Referenzdesign für Entfernungsmessungen per Ultraschall mit dem TLV320AIC3268-miniDSP-Codec

Bestellen & Qualität

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

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