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TCA4311A

ACTIVO

Búfer I2C/SMBus bidireccional de 2 bits de 2.7 V a 5.5 V intercambiable en caliente a 400 kHz

Detalles del producto

Features Buffer, Enable pin, Hot swap Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.7 VCCA (max) (V) 5.5 VCCB (min) (V) 2.7 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 85
Features Buffer, Enable pin, Hot swap Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.7 VCCA (max) (V) 5.5 VCCB (min) (V) 2.7 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 85
  • Operating Power-Supply Voltage Range of 2.7 V to 5.5 V
  • Supports Bidirectional Data Transfer of I2C Bus Signals
  • SDA and SCL Lines are Buffered Which Increases Fanout
  • 1-V Precharge on all SDA and SCL Lines Prevents Corruption During Live Board Insertion and Removal From Backplane
  • SDA and SCL Input Lines are Isolated From Outputs
  • Accommodates Standard Mode and Fast Mode I2C Devices
  • Improved Noise Immunity
  • Applications Include Hot Board Insertion and Bus Extension
  • Low ICC Chip Disable of < 1 µA
  • READY Open-Drain Output
  • Supports Clock Stretching, Arbitration, and Synchronization
  • Powered-Off High-Impedance I2C Pins
  • Open-Drain I2C Pins
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Operating Power-Supply Voltage Range of 2.7 V to 5.5 V
  • Supports Bidirectional Data Transfer of I2C Bus Signals
  • SDA and SCL Lines are Buffered Which Increases Fanout
  • 1-V Precharge on all SDA and SCL Lines Prevents Corruption During Live Board Insertion and Removal From Backplane
  • SDA and SCL Input Lines are Isolated From Outputs
  • Accommodates Standard Mode and Fast Mode I2C Devices
  • Improved Noise Immunity
  • Applications Include Hot Board Insertion and Bus Extension
  • Low ICC Chip Disable of < 1 µA
  • READY Open-Drain Output
  • Supports Clock Stretching, Arbitration, and Synchronization
  • Powered-Off High-Impedance I2C Pins
  • Open-Drain I2C Pins
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

The TCA4311A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock busses. Control circuitry prevents the backplane from being connected to the card until a stop command or bus idle occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the chip.

When the I2C bus is idle, the TCA4311A can be put into shutdown mode by setting the EN pin low. When EN is high, the TCA4311A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

Both the backplane and card may be powered with supply voltages ranging from 2.7 V to 5.5 V, with no restrictions on which supply voltage is higher.

The TCA4311A has standard open-drain I/Os. The size of the pull-up resistors to the I/Os depends on the system, but each side of this buffer must have a pull-up resistor. The device is designed to work with Standard Mode and Fast Mode I2C devices in addition to SMBus devices. Standard Mode I2C devices only specify 3 mA in a generic I2C system where Standard Mode devices and multiple masters are possible. Under certain conditions, high termination currents can be used.

The TCA4311A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock busses. Control circuitry prevents the backplane from being connected to the card until a stop command or bus idle occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the chip.

When the I2C bus is idle, the TCA4311A can be put into shutdown mode by setting the EN pin low. When EN is high, the TCA4311A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

Both the backplane and card may be powered with supply voltages ranging from 2.7 V to 5.5 V, with no restrictions on which supply voltage is higher.

The TCA4311A has standard open-drain I/Os. The size of the pull-up resistors to the I/Os depends on the system, but each side of this buffer must have a pull-up resistor. The device is designed to work with Standard Mode and Fast Mode I2C devices in addition to SMBus devices. Standard Mode I2C devices only specify 3 mA in a generic I2C system where Standard Mode devices and multiple masters are possible. Under certain conditions, high termination currents can be used.

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TCA9511A ACTIVO Búfer I2C/SMBus bidireccional de 2 bits de 2.3 V a 5.5 V intercambiable en caliente a 400 kHz The pin-to-pin device has improved performance (wider supply voltage rail, lower voltage offset, and wider temperature range).

Documentación técnica

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* Data sheet TCA4311A Hot Swappable 2-Wire Bus Buffers datasheet (Rev. C) PDF | HTML 16 ago 2018

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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