Inicio Interfaz Chips base de sistema (SBC)

TLIN1028S-Q1

ACTIVO

Transceptor de red de interconexión local (LIN) con regulador de tensión integrado para automoción

Detalles del producto

Protocols LIN, SBC Number of channels 1 Supply voltage (V) 5 to 28 Bus fault voltage (V) -58 to 58 Signaling rate (max) (bps) 100000 Rating Automotive
Protocols LIN, SBC Number of channels 1 Supply voltage (V) 5 to 28 Bus fault voltage (V) -58 to 58 Signaling rate (max) (bps) 100000 Rating Automotive
SOIC (D) 8 29.4 mm² 4.9 x 6
  • AEC-Q100 (Grade 1) : Qualified for automotive applications
  • Local interconnect network (LIN) physical layer specification ISO/DIS 17987–4 compliant and conforms to SAE J2602 recommended practice for LIN (See SLLA495)
  • Functional Safety-Capable
  • Supports 12-V applications
  • Wide operating ranges
    • ±58 V LIN bus fault protection
    • LDO output supporting 3.3 V or 5 V
    • Sleep mode: Ultra-low current consumption allows wake-up event from:
      • LIN bus or local wake through EN pin
    • Power-up and down glitch-free operation
  • Protection features:
    • ESD protection, VSUP under-voltage protection
    • TXD dominant time out (DTO) protection, Thermal shutdown
    • Unpowered node or ground disconnection fail-safe at system level
  • VCC sources up to 70 mA
  • Available in SOIC (8) package
  • AEC-Q100 (Grade 1) : Qualified for automotive applications
  • Local interconnect network (LIN) physical layer specification ISO/DIS 17987–4 compliant and conforms to SAE J2602 recommended practice for LIN (See SLLA495)
  • Functional Safety-Capable
  • Supports 12-V applications
  • Wide operating ranges
    • ±58 V LIN bus fault protection
    • LDO output supporting 3.3 V or 5 V
    • Sleep mode: Ultra-low current consumption allows wake-up event from:
      • LIN bus or local wake through EN pin
    • Power-up and down glitch-free operation
  • Protection features:
    • ESD protection, VSUP under-voltage protection
    • TXD dominant time out (DTO) protection, Thermal shutdown
    • Unpowered node or ground disconnection fail-safe at system level
  • VCC sources up to 70 mA
  • Available in SOIC (8) package

The TLIN1028S-Q1 is a local interconnect network (LIN) physical layer transceiver, compliant to LIN 2.2A ISO/DIS 17987–4 standards, with an integrated low dropout (LDO) voltage regulator.

LIN is a single-wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The LIN receiver supports data rates up to 100 kbps for end-of-line programming. The TLIN1028S-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal. The receiver converts the data stream to logic-level signals that are sent to the microprocessor through the open-drain RXD pin. The TLIN1028S-Q1 reduces system complexity by providing a 3.3 V or 5 V rail with up to 70 mA of current to power microprocessors, sensors or other devices. The TLIN1028S-Q1 has an optimized current-limited wave-shaping driver which reduces electromagnetic emissions (EME).

The TLIN1028S-Q1 is a local interconnect network (LIN) physical layer transceiver, compliant to LIN 2.2A ISO/DIS 17987–4 standards, with an integrated low dropout (LDO) voltage regulator.

LIN is a single-wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The LIN receiver supports data rates up to 100 kbps for end-of-line programming. The TLIN1028S-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal. The receiver converts the data stream to logic-level signals that are sent to the microprocessor through the open-drain RXD pin. The TLIN1028S-Q1 reduces system complexity by providing a 3.3 V or 5 V rail with up to 70 mA of current to power microprocessors, sensors or other devices. The TLIN1028S-Q1 has an optimized current-limited wave-shaping driver which reduces electromagnetic emissions (EME).

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Documentación técnica

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Tipo Título Fecha
* Data sheet TLIN1028S-Q1 Automotive 70-mA System Basis Chip (SBC) datasheet (Rev. B) PDF | HTML 31 may 2022
* Errata TLIN1028S-Q1 Duty Cycle Over VSUP 22 may 2020
User guide TLIN1028x EVM User's Guide (Rev. A) PDF | HTML 11 feb 2022
Functional safety information TLIN1028xS-Q1 Functional Safety FIT Rate, Failure Mode Distribution and Pin FMA (Rev. A) PDF | HTML 13 oct 2020

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TLIN1028EVM — Chip básico del sistema LIN TLIN1028 con módulo de evaluación de restablecimiento de LDO y MCU integ

This EVM can be used to evaluate the TLIN1028x family of devices. The LIN bus is easily accessed via the J6 and J9 connectors, along with VBAT and GND to make easy connections to real LIN systems. All logic signals are available through headers and test points, and modes are easily transitioned (...)
Guía del usuario: PDF | HTML
Modelo de simulación

TLIN1028-Q1 IBIS Model

SLLM440.ZIP (73 KB) - IBIS Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (D) 8 Ultra Librarian

Pedidos y calidad

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  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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