TMP139

ACTIVO

Sensor de temperatura JEDEC DDR5 con precisión de 0.5 °C

Detalles del producto

Local sensor accuracy (max) 0.5 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, I3C Supply voltage (max) (V) 1.98 Features Error Check, JEDEC JESD30201 Supply current (max) (µA) 9.1 Temp resolution (max) (bps) 11 Remote channels (#) 0 Addresses 2 Rating Catalog
Local sensor accuracy (max) 0.5 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, I3C Supply voltage (max) (V) 1.98 Features Error Check, JEDEC JESD30201 Supply current (max) (µA) 9.1 Temp resolution (max) (bps) 11 Remote channels (#) 0 Addresses 2 Rating Catalog
DSBGA (YAH) 6 1.099584 mm² 1.328 x 0.828
  • Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor
  • Exceeds JEDEC temperature accuracy specification:
    • ±0.25°C typical
    • ±0.5°C maximum (+75°C to +95°C)
    • ±0.75°C maximum (–40°C to +125°C)
  • Operating temperature range: –40°C to +125°C
  • Low power consumption:
    • 8.3-µA typical average quiescent current
    • 4.0-µA typical standby current
  • I/O power supply of 1 V
  • Core power supply of 1.8 V
  • Two wire serial bus interface (I 2C and I3C basic operation modes)
  • Up to 12.5-MHz data transfer rate in I3C basic mode
  • In Band Interrupt (IBI) for alerting host
  • Parity error check function for host writes
  • Packet error check function for host read and writes
  • 11-bit resolution: 0.25°C (1 LSB)
  • Standard 6-ball DSBGA (WCSP) package with 0.5-mm pitch
  • Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor
  • Exceeds JEDEC temperature accuracy specification:
    • ±0.25°C typical
    • ±0.5°C maximum (+75°C to +95°C)
    • ±0.75°C maximum (–40°C to +125°C)
  • Operating temperature range: –40°C to +125°C
  • Low power consumption:
    • 8.3-µA typical average quiescent current
    • 4.0-µA typical standby current
  • I/O power supply of 1 V
  • Core power supply of 1.8 V
  • Two wire serial bus interface (I 2C and I3C basic operation modes)
  • Up to 12.5-MHz data transfer rate in I3C basic mode
  • In Band Interrupt (IBI) for alerting host
  • Parity error check function for host writes
  • Packet error check function for host read and writes
  • 11-bit resolution: 0.25°C (1 LSB)
  • Standard 6-ball DSBGA (WCSP) package with 0.5-mm pitch

The TMP139 is a high-accuracy temperature sensor with an I 2C / I3C compliant digital interface supporting In Band Interrupts (IBI). Supporting the interface requirements of JEDEC JESD302-1 for Grade-B devices, the TMP139 exceeds the temperature accuracy requirements of the specification, enabling higher performance DDR5 memory modules. Available in a compact 6-ball DSBGA package, TMP139 is designed for high-speed, high-accuracy and low-power thermal monitoring applications.

The TMP139 has a typical accuracy of ±0.25°C over the entire temperature range from –40°C to +125 °C and offers an on-chip 11-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.25°C.

The TMP139 is designed to operate from a core power supply of 1.8 V and I/O power supply of 1 V, with a low typical average quiescent current of 8.3 µA when performing conversions every 125 ms.

The TMP139 is a high-accuracy temperature sensor with an I 2C / I3C compliant digital interface supporting In Band Interrupts (IBI). Supporting the interface requirements of JEDEC JESD302-1 for Grade-B devices, the TMP139 exceeds the temperature accuracy requirements of the specification, enabling higher performance DDR5 memory modules. Available in a compact 6-ball DSBGA package, TMP139 is designed for high-speed, high-accuracy and low-power thermal monitoring applications.

The TMP139 has a typical accuracy of ±0.25°C over the entire temperature range from –40°C to +125 °C and offers an on-chip 11-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.25°C.

The TMP139 is designed to operate from a core power supply of 1.8 V and I/O power supply of 1 V, with a low typical average quiescent current of 8.3 µA when performing conversions every 125 ms.

Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 3
Tipo Título Fecha
* Data sheet TMP139 0.5°C Accuracy, JEDEC DDR5 Grade B, Digital Temperature Sensor With I2C and I3C Interface datasheet (Rev. C) PDF | HTML 04 may 2023
Application brief Enhance Thermal Sensing Performance With I3C Bus PDF | HTML 22 dic 2021
Application note TMP139 Breakout Board Overview PDF | HTML 23 dic 2020

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Archivo Gerber

TMP139YAH Breakout Design Files

SNIC016.ZIP (2096 KB)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YAH) 6 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos