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TS3DV20812

ACTIVO

Multiplexor 1 a 2 y 2 a 1 diferencial de 2 canales y 2.2 Gbps para aplicaciones DVI 1.0/HDMI 1.2 a

Detalles del producto

Type Mux Protocols DVI, HDMI, LAN, LVD, VGA Rating Catalog Speed (max) (Gbpp) 2 Number of channels 11 Supply voltage (V) 3.3 Operating temperature range (°C) -40 to 85
Type Mux Protocols DVI, HDMI, LAN, LVD, VGA Rating Catalog Speed (max) (Gbpp) 2 Number of channels 11 Supply voltage (V) 3.3 Operating temperature range (°C) -40 to 85
VQFN (RHH) 36 36 mm² 6 x 6
  • Four High-Speed Bidirectional Differential Pair
    Channel MUX/DEMUX
  • Supports up to 2 Gbps Data Rate
  • VDD Operating Range 2.5 V or 3.3
    • –0 V to 3.3 V Rail To Rail at 2.5 V
    • –0 V to 5 V Rail To Rail at 3.3V
  • IOFF partial Powerdown and Back-Drive Protection.
  • 5-V Input Tolerant on Control Pin
  • Supports Both AC- and DC-Coupled Signals
  • Low Crosstalk: –38 dB at 825 MHz,
    2.5 V or 3.3 V
  • Insertion Loss: –1.5 dB at 825 MHz,
    2.5 V or 3.3 V
  • Off Isolation –24.67 dB at 825 MHz
  • Low Bit-to-Bit Skew within Pair 5 ps Maximum
  • Channel-to-Channel Skew: 30 ps Maximum
  • Propagation Delay Times: 250 ps Maximum
  • ESD Performance Tested per JESD 22
    • 2000-V Human Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • APPLICATIONS
    • HDMI/DVI Video MUX
    • Panel LVDS Bus MUX
    • LVDS, LVPECL, CML
    • Analog Signals VGA
    • Gigabit LAN Signal MUX
    • Serial Backplane Signal MUX
    • Optical Module
    • Central Office Telecommunication
    • Wireless Base Station
    • High-Speed Logic Data I/O MUX

  • Four High-Speed Bidirectional Differential Pair
    Channel MUX/DEMUX
  • Supports up to 2 Gbps Data Rate
  • VDD Operating Range 2.5 V or 3.3
    • –0 V to 3.3 V Rail To Rail at 2.5 V
    • –0 V to 5 V Rail To Rail at 3.3V
  • IOFF partial Powerdown and Back-Drive Protection.
  • 5-V Input Tolerant on Control Pin
  • Supports Both AC- and DC-Coupled Signals
  • Low Crosstalk: –38 dB at 825 MHz,
    2.5 V or 3.3 V
  • Insertion Loss: –1.5 dB at 825 MHz,
    2.5 V or 3.3 V
  • Off Isolation –24.67 dB at 825 MHz
  • Low Bit-to-Bit Skew within Pair 5 ps Maximum
  • Channel-to-Channel Skew: 30 ps Maximum
  • Propagation Delay Times: 250 ps Maximum
  • ESD Performance Tested per JESD 22
    • 2000-V Human Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • APPLICATIONS
    • HDMI/DVI Video MUX
    • Panel LVDS Bus MUX
    • LVDS, LVPECL, CML
    • Analog Signals VGA
    • Gigabit LAN Signal MUX
    • Serial Backplane Signal MUX
    • Optical Module
    • Central Office Telecommunication
    • Wireless Base Station
    • High-Speed Logic Data I/O MUX

TS3DV20812 is a High Speed Data Rate up to 2Gbps for Differential Signal Passive bi-directional Multiplexer and De-multiplexer for I/O rails up to 5V Level with Low Crosstalk and Insertion Loss.

TS3DV20812 can be used in either HDMI/DVI sink side or source side with 4-differential pair supporting the high speed and control pins.

The Ioff and back drive protection allowing to connect the external cable and prevent the back flow current when the Vcc is into 0V.

The 3 side band signals can be used in DDC (SDAL, SCL) and CEC Signal MUX.

TS3DS20812 is characterized for operation from –40°C to 85°C.

TS3DV20812 is a High Speed Data Rate up to 2Gbps for Differential Signal Passive bi-directional Multiplexer and De-multiplexer for I/O rails up to 5V Level with Low Crosstalk and Insertion Loss.

TS3DV20812 can be used in either HDMI/DVI sink side or source side with 4-differential pair supporting the high speed and control pins.

The Ioff and back drive protection allowing to connect the external cable and prevent the back flow current when the Vcc is into 0V.

The 3 side band signals can be used in DDC (SDAL, SCL) and CEC Signal MUX.

TS3DS20812 is characterized for operation from –40°C to 85°C.

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Documentación técnica

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* Data sheet 2-Gbps Differential SWITCH 8-Bits, 1: 2 MUX/DEMUX With 3-Side Band Signals datasheet 27 jun 2010

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

TS3DV20812 IBIS Model

SCDM147.ZIP (45 KB) - IBIS Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RHH) 36 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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