AFE4300
- Weight-scale front-end:
- Supports up to four load cell inputs
- On-chip load cell 1.7-V excitation voltage for ratiometric measurement
- 68-nVrms Input-Referred noise
(0.1 Hz to 2 Hz) - Best-fit linearity: 0.01% of full-scale
- Weight-scale measurement : 540 µA
- Body composition front-end:
- Supports up to three tetra-polar complex impedance measurements
- 6-Bit, 1-MSPS sine-wave generation digital-to-analog converter (DAC)
- 247.5-µArms, ±20% Excitation source
- 0.1-Ω Measurement RMS noise in 2-Hz BW
- Body composition measurement : 970 µA
- Analog-to-digital converter (ADC):
- 16 Bits, 860 SPS
- Supply current: 110 µA
The AFE4300 is a low-cost analog front-end incorporating two separate signal chains: one chain for weight-scale (WS) measurement and the other for body composition measurement (BCM) analysis. A 16-bit, 860-SPS analog-to-digital converter (ADC) is multiplexed between both chains. The weight measurement chain includes an instrumentation amplifier (INA) with the gain set by an external resistor, followed by a 6-bit digital-to-analog converter (DAC) for offset correction, and a circuit to drive the external bridge/load cell with a fixed 1.7 V for ratiometric measurements.
The AFE4300 can also measure body composition by applying a sinusoidal current into the body. The sinusoidal current is generated with an internal pattern generator and a 6-bit, 1-MSPS DAC. A voltage-to-current converter applies this sinusoidal current into the body, between two terminals. The voltage created across these two terminals as a result of the impedance of the body is measured back with a differential amplifier, rectified, and the amplitude is extracted and measured by the 16-bit ADC.
The AFE4300 operates from 2 V to 3.6 V, is specified from 0°C to +70°C, and is available in a LQFP-80 package.
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기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | AFE4300 Low-Cost, Integrated Analog Front-End for Weight-Scale and Body Composition Measurement datasheet | PDF | HTML | 2019/08/16 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치