AM69
Processor cores:
- Up to eight 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2GHz
- 2MB shared L2 cache per quad-core Cortex®-A72 cluster
- 32KB L1 D-Cache and 48KB L1 I-Cache per Cortex®-A72 core
- Up to Four Deep Learning Accelerators:
- Each with up to 8 Trillion Operations Per Second (TOPS)
- Total of 32 Trillion Operations Per Second (32TOPS)
- Dual-core Arm Cortex-R5F MCUs at up to 1.0GHz in General Compute partition with FFI
- 16KB L1 D-Cache, 16KB L1 I-Cache, and 64KB L2 TCM
- Dual-core Arm® Cortex®-R5F MCUs at up to 1.0GHz to support Device Management
- 32K L1 D-Cache, 32K I-Cache, and 64K L2 TCM with SECDED ECC on all memories
- Up to two Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
- 480MPixel/s ISP
- Support for up to 16-bit input RAW format
- Wide Dynamic Range (WDR), Lens Distortion Correction (LDC), Vision Imaging Subsystem (VISS), and Multi-Scalar (MSC) support
- Output color format : 8-bits, 12-bits, and YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL
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Multimedia:
- Display subsystem supports:
- Up to 4 displays
- Up to two DSI 4L TX (up to 2.5K)
- One eDP 4L
- One DPI 24-bit RGB parallel interface
- Safety features such as freeze frame detection and MISR data check
- 3D Graphics Processing Unit
- IMG BXS-4-64, up to 800MHz
- 50GFLOPS, 4GTexels/s
- Support for APIs OpenGL ES 3.1, Vulkan 1.2
- Three CSI2.0 4L Camera Serial interface RX (CSI-RX) plus two CSI2.0 4L TX (CSI-TX) with DPHY
- MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
- CSI-RX supports for 1,2,3, or 4 data lane mode up to 2.5Gbps per lane
- CSI-TX supports for 1,2, or 4 data lane mode up to 2.5Gbps per lane
- Two Video Encoder/Decoder Modules
- Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
- Support for H.264 BaseLine/Main/High Profiles at Level 5.2
- Support for up to 4K UHD resolution (3840 × 2160) per module
- Each module supports 4K60 H.264/H.265 Encode/Decode (up to 480MP/s)
Memory subsystem:
- Display subsystem supports:
- Up to 8MB of on-chip L3 RAM with ECC and coherency
- ECC error protection
- Shared coherent cache
- Supports internal DMA engine
- Up to Four External Memory Interface (EMIF) module with ECC
- Supports LPDDR4 memory types
- Supports speeds up to 4266MT/s
- Up to 4x32-b bus with inline ECC up to 68GB/s
- General-Purpose Memory Controller (GPMC)
- 512KB on-chip SRAM in MAIN domain, protected by ECC
- AEC-Q100 qualified on part number variants ending in Q1
Device security:
- Secure boot with secure run-time support
- Customer programmable root key, up to RSA-4K or ECC-512
- Embedded hardware security module
- Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES
High speed serial interfaces:
- Integrated Ethernet switch supporting up to 8 external ports
- Two ports support 5Gb, 10Gb USXGMII or 5Gb XFI
- All ports support 1Gb, 2.5Gb SGMII
- All ports can support QSGMII. A maximum of 2 QSGMII can be enabled and uses all 8 internal lanes. 1 QSGMII interfaces uses 4 internal lanes.
- Up to 4x2-L/2x4L PCI-Express (PCIe) Gen3 controllers
- Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
- One USB 3.0 dual-role device (DRD) subsystem
- Enhanced SuperSpeed Gen1 Port
- Supports Type-C switching
- Independently configurable as USB host, USB peripheral, or USB DRD
Ethernet
- Two RGMII/RMII interfaces
Automotive interfaces:
- Twenty Modular Controller Area Network (MCAN) modules with full CAN-FD support
Audio interfaces:
- Five Multichannel Audio Serial Port (MCASP) modules
Flash memory interfaces:
- Embedded MultiMediaCard Interface ( eMMC™ 5.1)
- One Secure Digital 3.0 / Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0
- Universal Flash Storage (UFS 2.1) interface with two lanes
- Two independent flash interfaces configured as
- One OSPI or HyperBus™ or QSPI flash interfaces, and
- One QSPI flash interface
System-on-Chip (SoC) architecture:
- 16-nm FinFET technology
- 31mm × 31mm, 0.8-mm pitch, 1414-pin FCBGA (ALY), enables IPC class 3 PCB routing
- 27mm × 27mm, 0.8-mm pitch, 1063-pin FCBGA (AND), enables IPC class 3 PCB routing
TPS6594-Q1 Companion Power Management ICs (PMIC):
- Functional Safety support up to ASIL-D
- Flexible mapping to support different use cases
The AM69, AM69A scalable processor family is based on the evolutionary Jacinto™ 7 architecture, targeted at Smart Vision Camera applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the Vision processor market. The AM69x family is built for a broad set of cost-sensitive high-performance compute applications in Factory Automation, Building Automation, and other markets.
The AM69, AM69A provides high performance compute technology for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced vision camera applications. Key cores include the latest Arm and GPU processors for general compute, next generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, an integrated next generation imaging subsystem (ISP), video codec, and isolated MCU island. All protected by industrial-grade safety and security hardware accelerators.
General Compute Cores and Integration Overview: Two quad-core cluster configurations (8 cores total) of Arm® Cortex®-A72 facilitate multi-OS applications with minimal need for a software hypervisor. Up to two Dual-core (4 cores total) Arm® Cortex®-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm® Cortex®-A72 core’s unencumbered for applications. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features support operations up to SIL-2 levels while the integrated security features protect data against modern day attacks. CSI2.0 ports enable multi sensor inputs.
Key Performance Cores Overview: The C7000™ DSP next generation core (“C7x”) combines TI’s industry leading DSP and EVE cores into a single higher performance core and adds floating-point vector calculation capabilities, enabling backward compatibility for legacy code while simplifying software programming. Four “MMAv2” deep learning accelerators enable performance up to 32 Trillion Operations Per Second (TOPS) [8TOPS per core] within the lowest power envelope in the industry, even when operating even at the worst case junction temperatures of 105°C and 125°C. The dedicated Vision hardware accelerators provide vision pre-processing with no impact on system performance. The C7x/MMA cores are available only for deep-learning function in the AM69, AM69A class of processors.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | AM69x Processors, Silicon Revision 1.0 datasheet (Rev. D) | PDF | HTML | 2024/12/13 |
| * | Errata | J784S4, TDA4AP, TDA4VP, TDA4AH, TDA4VH, AM69A Processors Silicon Revision 1.0 (Rev. B) | PDF | HTML | 2024/07/24 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치