인터페이스 이더넷 IC 이더넷 PHY

10/100Mbps 통합 PCI 이더넷 미디어 액세스 컨트롤러 및 물리적 계층(MacPhyter-II)

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Datarate (Mbps) 10/100 Interface type PCI (33MHz) Number of ports Single Rating Catalog Features 5-V tolerant I/Os Supply voltage (V) 3.3 Operating temperature range (°C) 0 to 70 Number of LEDs 3 ESD HBM (kV) 2
Datarate (Mbps) 10/100 Interface type PCI (33MHz) Number of ports Single Rating Catalog Features 5-V tolerant I/Os Supply voltage (V) 3.3 Operating temperature range (°C) 0 to 70 Number of LEDs 3 ESD HBM (kV) 2
LQFP (PGE) 144 484 mm² 22 x 22
  • IEEE 802.3 Compliant, PCI V2.2 Media Access
    Controller (MAC) and Bus Interface Unit (BIU)
    Supports Traditional Data Rates of 10 Mb/s
    Ethernet and 100 Mb/s Fast Ethernet (Through
    Internal PHY)
  • Bus Master – Burst Sizes of up to 128 Dwords
    (512 Bytes)
  • BIU Compliant With PC 97 and PC 98 Hardware
    Design Guides, PC 99 Hardware Design Guide
    Draft, ACPI v1.0, PCI Power Management
    Specification v1.1, OnNow Device Class Power
    Management Reference Specification – Network
    Device Class v1.0a
  • Wake on LAN (WoL) Support Compliant With
    PC98, PC99, SecureOn, and OnNow, Including
    Directed Packets, Magic Packet™ VLAN Packets,
    ARP Packets, Pattern Match Packets, and PHY
    Status Change
  • Clkrun Function for PCI Mobile Design Guide
  • Virtual LAN (VLAN) and Long Frame Support
  • Support for IEEE 802.3× Full-Duplex Flow Control
  • Extremely Flexible Rx Packet Filtration Including:
    Single Address Perfect Filter With MSb Masking,
    Broadcast, 512 Entry Multicast and Unicast Hash
    Table, Deep Packet Pattern Matching for up to
    Four Unique Patterns
  • Statistics Gathered for Support of RFC 1213
    (MIB II), RFC 1398 (Ether-Like MIB), IEEE 802.3
    LME, Reducing CPU Overhead for Management
  • Internal 2KB Transmit and 2KB Receive Data
    FIFOs
  • Serial EEPROM Port With Auto-Load of
    Configuration Data From EEPROM at Power On
  • Flash or PROM Interface for Remote Boot Support
  • Fully Integrated IEEE 802.3 3.3-V CMOS Physical
    Layer
  • IEEE 802.3 10BASE-T Transceiver With Integrated
    Filters IEEE 802.3u 100BASE-TX Transceiver
  • Fully integrated ANSI X3.263 Compliant TP-PMD
    Physical Sublayer With Adaptive Equalization and
    Baseline Wander Compensation
  • IEEE 802.3u Auto-Negotiation – Advertised
    Features Configurable Through EEPROM
  • Full-Duplex Support for 10- and 100-Mb/s Data
    Rates
  • Single 25-MHz Reference Clock
  • 144-pin LQFP Package
  • Low-Power 3.3-V CMOS Design With Typical
    Consumption of 383 mW Operating, 297 mW
    During WoL, and 53 mW During Sleep Mode
  • IEEE 802.3u MII for Connecting Alternative
    External Physical Layer Devices
  • 3.3-V Signaling With 5-V Tolerant I/O
  • IEEE 802.3 Compliant, PCI V2.2 Media Access
    Controller (MAC) and Bus Interface Unit (BIU)
    Supports Traditional Data Rates of 10 Mb/s
    Ethernet and 100 Mb/s Fast Ethernet (Through
    Internal PHY)
  • Bus Master – Burst Sizes of up to 128 Dwords
    (512 Bytes)
  • BIU Compliant With PC 97 and PC 98 Hardware
    Design Guides, PC 99 Hardware Design Guide
    Draft, ACPI v1.0, PCI Power Management
    Specification v1.1, OnNow Device Class Power
    Management Reference Specification – Network
    Device Class v1.0a
  • Wake on LAN (WoL) Support Compliant With
    PC98, PC99, SecureOn, and OnNow, Including
    Directed Packets, Magic Packet™ VLAN Packets,
    ARP Packets, Pattern Match Packets, and PHY
    Status Change
  • Clkrun Function for PCI Mobile Design Guide
  • Virtual LAN (VLAN) and Long Frame Support
  • Support for IEEE 802.3× Full-Duplex Flow Control
  • Extremely Flexible Rx Packet Filtration Including:
    Single Address Perfect Filter With MSb Masking,
    Broadcast, 512 Entry Multicast and Unicast Hash
    Table, Deep Packet Pattern Matching for up to
    Four Unique Patterns
  • Statistics Gathered for Support of RFC 1213
    (MIB II), RFC 1398 (Ether-Like MIB), IEEE 802.3
    LME, Reducing CPU Overhead for Management
  • Internal 2KB Transmit and 2KB Receive Data
    FIFOs
  • Serial EEPROM Port With Auto-Load of
    Configuration Data From EEPROM at Power On
  • Flash or PROM Interface for Remote Boot Support
  • Fully Integrated IEEE 802.3 3.3-V CMOS Physical
    Layer
  • IEEE 802.3 10BASE-T Transceiver With Integrated
    Filters IEEE 802.3u 100BASE-TX Transceiver
  • Fully integrated ANSI X3.263 Compliant TP-PMD
    Physical Sublayer With Adaptive Equalization and
    Baseline Wander Compensation
  • IEEE 802.3u Auto-Negotiation – Advertised
    Features Configurable Through EEPROM
  • Full-Duplex Support for 10- and 100-Mb/s Data
    Rates
  • Single 25-MHz Reference Clock
  • 144-pin LQFP Package
  • Low-Power 3.3-V CMOS Design With Typical
    Consumption of 383 mW Operating, 297 mW
    During WoL, and 53 mW During Sleep Mode
  • IEEE 802.3u MII for Connecting Alternative
    External Physical Layer Devices
  • 3.3-V Signaling With 5-V Tolerant I/O

The DP83816 device is a single-chip 10/100 Mb/s ethernet controller for the PCI bus. It is targeted at low-cost, high-volume PC motherboards, adapter cards, and embedded systems. The DP83816 device fully implements the V2.2 33-MHz PCI bus interface for host communications with power management support. Packet descriptors and data are transferred via bus-mastering, reducing the burden on the host CPU. The DP83816 device can support full-duplex 10/100 Mb/s transmission and reception with minimum interframe gap.

The DP83816 device is a single-chip 10/100 Mb/s ethernet controller for the PCI bus. It is targeted at low-cost, high-volume PC motherboards, adapter cards, and embedded systems. The DP83816 device fully implements the V2.2 33-MHz PCI bus interface for host communications with power management support. Packet descriptors and data are transferred via bus-mastering, reducing the burden on the host CPU. The DP83816 device can support full-duplex 10/100 Mb/s transmission and reception with minimum interframe gap.

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유형 직함 날짜
* Data sheet Integrated PCI Ethernet Media Access Contrlr & Phy Layer (MacPhyter-II) datasheet (Rev. E) 2015/12/31

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치