데이터 시트
ISO1432
- Compatible with TIA/EIA-485-A
- PROFIBUS compatible at 5V bus-side supply
- Bus I/O protection
- ±30kV HBM
- ±16kV IEC 61000-4-2 Contact discharge
- ±4kV IEC 61000-4-4 Electrical fast transient
- Low-EMI 500kbps, 12Mbps and 50Mbps Data Rates
- 1.71V to 5.5V logic-side supply (VCC1), 3V to 5.5V bus-side supply (VCC2)
- Failsafe receiver for bus open, short, and idle
- 1/8 Unit load up to 256 nodes on bus
- 100kV/µs (typical) high common-mode transient immunity
- Extended temperature range from –40°C to 125°C
- Glitch-free power-up and power-down for hot plug-in
- Wide-body SOIC-16 package
- Pin compatible to most isolated RS-485 transceivers
- Safety-related certifications:
- 7071VPK VIOTM and 1500VPK VIORM (reinforced and basic options) per DIN VDE V 0884-11:2017-01
- 5000VRMS isolation for 1 minute per UL 1577
- IEC 60950-1, IEC 62368-1, IEC 60601-1 and IEC 61010-1 certifications
- CQC, TUV, and CSA approvals
The ISO14xx devices are galvanically-isolated differential line transceivers for TIA/EIA RS-485 and RS-422 applications. These noise-immune transceivers are designed to operate in harsh industrial environments. The bus pins of these devices can endure high levels of IEC electrostatic discharge (ESD) and IEC electrical fast transient (EFT) events which eliminates the need for additional components on bus for system-level protection. The devices are available for both basic and reinforced isolation (see Reinforced and Basic Isolation Options).
![정보](https://www.ti.com/content/dam/ticom/images/icons/illustrative-icons/resources/information-icon.png)
기술 자료
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16개 모두 보기 설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
평가 보드
ISO1412DWEVM — ISO1412DW 고성능, 견고한 EMC 절연 전이중 RS-485 평가 모듈
The ISO1412DWEVM is an evaluation module (EVM) used to evaluate the high-performance, reinforced isolated RS-485 ISO1412 in a 16-pin package (package code DW). The EVM features enough test points and jumper options for you to evaluate the device with minimal external components.
사용 설명서: PDF
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.