LMV112
- (Typical Values are: VSUPPLY = 2.7V and
CL = 20 pF, Unless Otherwise Specified.) - Small Signal Bandwidth 40 MHz
- Supply Voltage Range 2.4V to 5V
- Slew Rate 110 V/μs
- Total Supply Current 1.6 mA
- Shutdown Current 59 µA
- Rail-to-Rail Input and Output
- Individual Buffer Enable Pins
- Rapid Ton Technology
- Crosstalk Rejection Circuitry
- 8-pin WSON, Pin Access Packaging
- Temperature Range −40°C to 85°C
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The LMV112 is a high speed dual clock buffer designed for portable communications and accurate multi-clock systems. The LMV112 integrates two 40 MHz low noise buffers which optimizes application and out performs large discrete solutions. This device enables superb system operation between the base band and the oscillator signal path while eliminating crosstalk.
Texas Instruments' unique technology and design deliver accuracy, capacitance and load resistance while increasing the drive capability of the device. The low power consumption makes the LMV112 perfect for battery applications.
The robust, independent, and flexible buffers are designed to provide the customer with the ability to manage complex clock signals in the latest wireless applications. The buffers deliver 110 V/μs internal slew rate with independent shutdown and duty cycle precision. The patented analog circuit drives capacitive loads beyond 20 pF. Texas Instruments' proven biasing technique has 1V centering, rail-to-rail input/output unity gain, and AC coupled convenient inputs. These integrated cells save space and require no external bias resistors. Texas Instruments' rapid recovery after disable optimizes performance and current consumption. The LMV112 offers individual enable pin controls and since there is no internal ground reference either single or split supply configurations offer additional system flexibility and power choices.
The LMV112 is a proven replacement for any discrete circuitry and simplifies board layout while minimizing related parasitic components.
The LMV112 is produced in the small WSON package which offers high quality while minimizing its use of PCB space. Texas Instruments' advanced packaging offers direct PCB-IC evaluation via pin access.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | LMV112 40 MHz Dual Clock Buffer datasheet (Rev. B) | 2013/05/02 | |
EVM User's guide | AN-1799 LMV112 40 MHz Dual Clock Buffer Evaluation Board (Rev. A) | 2013/04/30 | ||
Application note | Use of the LMV112 to Reduce Ref Clk Interaction in Handheld Device (Rev. A) | 2013/04/30 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
WSON (NGQ) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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