SMV512K32-SP
- 20-ns Read, 13.8-ns Write Through Maximum Access Time
- Functionally Compatible With Commercial
512K x 32 SRAM Devices - Built-In EDAC (Error Detection and Correction) to Mitigate Soft Errors
- Built-In Scrub Engine for Autonomous Correction
- CMOS Compatible Input and Output Level, Three State Bidirectional
Data Bus- 3.3 ±0.3-V I/O, 1.8 ±0.15-V CORE
- Radiation Performance(1)
- Uses Both Substrate Engineering and Radiation Hardened by Design (HBD)(2)
- TID Immunity > 3e5 rad (Si)
- SER < 5e-17 Upsets/Bit-Day (Core Using EDAC and Scrub)(3)
- Latch up immunity > LET = 110 MeV (T = 398K)
(1) Radiation tolerance is a typical value based upon initial device qualification. Radiation Data and Lot Acceptance Testing is available – contact factory for details.
(2) HardSIL™ technology and memory design under a license agreement with Silicon Space Technology (SST).
(3) SER calculated using CREME96 for geosynchronous orbit,
solar minimum.
(4) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (e.g. no burn-in, etc.) and are tested to temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance on full MIL specified temperature range of –55°C to 125°C or operating life.
The SMV512K32 is a high performance asynchronous CMOS SRAM organized as 524,288 words by 32 bits. It is pin selectable between two modes: master or slave. The master device selection provides user defined autonomous EDAC scrubbing options. The slave device selection employs a scrub on demand feature that can be initiated by a master device. Three read cycles and four write cycles (described below) are available depending on the user needs.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 16-Mb Radiation-Hardened SRAM datasheet (Rev. I) | 2014/01/02 | |
* | SMD | SMV512K32-SP SMD 5962-11237 | 2016/07/08 | |
Selection guide | TI Space Products (Rev. J) | 2024/02/12 | ||
More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 2023/08/31 | ||
Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) | PDF | HTML | 2022/11/17 | |
Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022/10/19 | |
Application note | 16 MB Radiation-Hardened SRAM with EDAC to Mitigate Soft Errors (Rev. A) | 2019/08/02 | ||
E-book | Radiation Handbook for Electronics (Rev. A) | 2019/05/21 | ||
User guide | SMV512K32-CVAL User Guide | 2012/01/12 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CFP (HFG) | 76 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치