SN54AHC125

활성

3상 출력을 지원하는 군사용 4채널, 2V~5.5V 버퍼

제품 상세 정보

Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 IOL (max) (mA) 50 Supply current (max) (µA) 40 IOH (max) (mA) -50 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 IOL (max) (mA) 50 Supply current (max) (µA) 40 IOH (max) (mA) -50 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67 CFP (W) 14 58.023 mm² 9.21 x 6.3 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Operating range of 2V to 5.5V
  • Latch-up performance exceeds 250mA per JESD 17
  • Four individual output enable pins
  • Operating range of 2V to 5.5V
  • Latch-up performance exceeds 250mA per JESD 17
  • Four individual output enable pins

The SNx4AHC125 devices are quadruple bus buffer gates featuring independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable ( OE) input is high. When OE is low, the respective gate passes the data from the A input to its Y output.

To ensure the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SNx4AHC125 devices are quadruple bus buffer gates featuring independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable ( OE) input is high. When OE is low, the respective gate passes the data from the A input to its Y output.

To ensure the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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기술 자료

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21개 모두 보기
유형 직함 날짜
* Data sheet SNx4AHC125 Quadruple Bus Buffer Gates With 3-State Outputs datasheet (Rev. O) PDF | HTML 2024/02/27
* SMD SN54AHC125 SMD 5962-96868 2016/06/21
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 2002/12/02
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 2000/02/24
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 1998/04/01
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Live Insertion 1996/10/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 CAD 기호, 풋프린트 및 3D 모델
CDIP (J) 14 Ultra Librarian
CFP (W) 14 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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