홈 로직 및 전압 변환 버퍼, 드라이버 및 트랜시버 인버팅 버퍼 및 드라이버
홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
인버팅 버퍼 및 드라이버

SN74AUP2G14

활성

슈미트 트리거 입력을 지원하는 2채널, 0.8V~3.6V 저전력 인버터

지금 주문하기
데이터 시트

SN74AUP2G14

활성
데이터 시트 지금 주문하기

제품 상세 정보

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 2 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 2 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
DSBGA (YFP) 6 1.4000000000000001 mm² 1 x 1.4000000000000001 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Texas Instruments NanoStar™ package
  • Low static-power consumption (ICC = 0.9µA maximum)
  • Low dynamic-power consumption (Cpd = 4.3pF typical at 3.3V)
  • Low input capacitance (Ci = 1.5pF typical)
  • Low noise – overshoot and undershoot <10% of VCC
  • Ioff supports partial-power-down mode operation
  • Wide operating VCC range of 0.8V to 3.6V
  • Optimized for 3.3V operation
  • 3.6V I/O tolerant to support mixed-mode signal Operation
  • tpd = 4.3ns maximum at 3.3V
  • Suitable for point-to-point applications
  • Latch-up performance exceeds 100mA Per JESD 78, Class II
  • ESD performance tested per JESD 22
    • 2000V human-body model (A114-B, Class II)
    • 1000V charged-device model (C101)
  • Available in the Texas Instruments NanoStar™ package
  • Low static-power consumption (ICC = 0.9µA maximum)
  • Low dynamic-power consumption (Cpd = 4.3pF typical at 3.3V)
  • Low input capacitance (Ci = 1.5pF typical)
  • Low noise – overshoot and undershoot <10% of VCC
  • Ioff supports partial-power-down mode operation
  • Wide operating VCC range of 0.8V to 3.6V
  • Optimized for 3.3V operation
  • 3.6V I/O tolerant to support mixed-mode signal Operation
  • tpd = 4.3ns maximum at 3.3V
  • Suitable for point-to-point applications
  • Latch-up performance exceeds 100mA Per JESD 78, Class II
  • ESD performance tested per JESD 22
    • 2000V human-body model (A114-B, Class II)
    • 1000V charged-device model (C101)

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8V to 3.6V, resulting in increased battery life (see Figure 5-1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 5-2).

The SN74AUP2G14 contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8V to 3.6V, resulting in increased battery life (see Figure 5-1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 5-2).

The SN74AUP2G14 contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
filter 기타 인버팅 버퍼 및 드라이버 찾기
다운로드 스크립트와 함께 비디오 보기 비디오

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
6개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet SN74AUP2G14 Low-Power Dual Schmitt-Trigger Inverter datasheet (Rev. D) PDF | HTML 2025/06/01
Selection guide Logic Guide (Rev. AC) PDF | HTML 2025/11/13
Application brief Understanding Schmitt Triggers (Rev. B) PDF | HTML 2025/04/17
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

5-8-LOGIC-EVM — 5핀~8핀 DCK, DCT, DCU, DRL 및 DBV 패키지용 일반 논리 평가 모듈

5~8핀 수의 DCK, DCT, DCU, DRL 또는 DBV 패키지가 있는 모든 디바이스를 지원하도록 설계된 유연한 EVM.
사용 설명서: PDF
TI.com에서 구매할 수 없음
평가 보드

5-8-NL-LOGIC-EVM — 5-8핀 DPW, DQE, DRY, DSF, DTM, DTQ 및 DTT 패키지를 지원하는 일반 로직 및 변환 EVM

DTT, DRY, DPW, DTM, DQE, DQM, DSF 또는 DTQ 패키지가 있는 로직 또는 변환 디바이스를 지원하도록 설계된 일반 EVM. 보드 설계는 유연한 평가가 가능합니다.

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
시뮬레이션 모델

SN74AUP2G14 Behavioral SPICE Model

SCEM674.ZIP (7 KB) - PSpice Model
다운로드
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
DSBGA (YFP) 6 Ultra Librarian
SOT-SC70 (DCK) 6 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상