SN74LV1T126-Q1
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AEC-Q100 qualified for automotive applications:
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Device temperature grade 1: -40°C to +125°C
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Device HBM ESD classification level 2
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Device CDM ESD classification level C4B
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- Wide operating range of 1.8 V to 5.5 V
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Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):
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Up translation:
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1.2 V to 1.8 V
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1.5 V to 2.5 V
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1.8 V to 3.3 V
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3.3 V to 5.0 V
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Down translation:
- 5.0 V, 3.3 V, 2.5 V to 1.8 V
- 5.0 V, 3.3 V to 2.5 V
- 5.0 V to 3.3 V
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- 5.5-V tolerant input pins
- Supports standard pinouts
- Up to 150 Mbps with 5-V or 3.3-V V CC
- Latch-up performance exceeds 250 mA per JESD 17
The SN74LV1T126-Q1 is a single buffer gate with 3-state outputs and integrated voltage translation. This buffer performs the Boolean function Y = A in positive logic. The outputs can be placed into a Hi-Z state by applying a Low on the OE pin. The output level is referenced to the supply voltage (V CC) and supports 1.8-V, 2.5-V, 3.3-V, and 5-V CMOS levels.
The input is designed with a lower threshold circuit to support up translation for lower voltage CMOS inputs (for example, 1.2 V input to 1.8 V output or 1.8 V input to 3.3 V output). In addition, the 5-V tolerant input pins enable down translation (for example, 3.3 V to 2.5 V output).
기술 자료
유형 | 직함 | 날짜 | ||
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* | Data sheet | SN74LV1T126-Q1 AutomotiveSingle Buffer Gate With 3-State Output and Integrated Translation datasheet (Rev. A) | PDF | HTML | 2023/11/16 |
Application note | Schematic Checklist - A Guide to Designing With Fixed or Direction Control Translators | PDF | HTML | 2024/10/02 | |
Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024/07/12 | |
Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024/07/03 |
설계 및 개발
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5-8-LOGIC-EVM — 5핀~8핀 DCK, DCT, DCU, DRL 및 DBV 패키지용 일반 논리 평가 모듈
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치