SN74LV4T125-EP
- Wide operating range of 1.8V to 5.5V
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Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):
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Up translation:
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1.2V to 1.8V
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1.5V to 2.5V
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1.8V to 3.3V
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3.3V to 5.0V
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Down translation:
- 5.0V, 3.3V, 2.5V to 1.8V
- 5.0V, 3.3V to 2.5V
- 5.0V to 3.3V
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- 5.5V tolerant input pins
- Supports standard pinouts
- Up to 150Mbps with 5V or 3.3V VCC
- Latch-up performance exceeds 250mA per JESD 17
The SN74LV4T125-EP contains four independent buffers with 3-state outputs and extended voltage operation to allow for level translation. Each buffer performs the Boolean function Y = A in positive logic. The outputs can be put into a high impedance (Hi-Z) state by applying a HIGH on the OE pin. The output level is referenced to the supply voltage (VCC) and supports 1.8V, 2.5V, 3.3V, and 5V CMOS levels.
The input is designed with a lower threshold circuit to support up translation for lower voltage CMOS inputs (for example, 1.2V input to 1.8V output or 1.8V input to 3.3V output). In addition, the 5V tolerant input pins enable down translation (for example, 3.3V to 2.5V output).
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | SN74LV4T125-EP Single Power Supply Quadruple Buffer Translator GATE With 3-State Output CMOS Logic Level Shifter datasheet | PDF | HTML | 2024/01/31 |
* | Radiation & reliability report | SN74LV4T125-EP Enhanced Product Qualification and Reliability Report | PDF | HTML | 2024/03/08 |
Application note | Schematic Checklist - A Guide to Designing With Fixed or Direction Control Translators | PDF | HTML | 2024/10/02 | |
Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024/07/12 | |
Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024/07/03 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 14 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치