홈 로직 및 전압 변환 구성 가능 및 프로그래머블 로직 IC 프로그래머블 로직 어레이(PLA)
홈
로직 및 전압 변환
구성 가능 및 프로그래머블 로직 IC
프로그래머블 로직 어레이(PLA)

TIBPAL20R4-20M

활성

고성능 Impact PAL 회로

지금 주문
데이터 시트

TIBPAL20R4-20M

활성
데이터 시트 지금 주문

제품 상세 정보

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (JT) 24 221.44 mm² 32 x 6.92 LCCC (FD) 28 130.6449 mm² 11.43 x 11.43
  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.
filter 기타 프로그래머블 로직 어레이(PLA) 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
1개 모두 보기
유형 직함 날짜
* Data sheet HighPerformance Impact Programmable Array Logic Circuits datasheet (Rev. A) 2011/01/05

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 핀 CAD 기호, 풋프린트 및 3D 모델
CDIP (JT) 24 Ultra Librarian
LCCC (FD) 28 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상