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비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
TLE2161
- Excellent Output Drive Capability
VO = ± 2.5 V Min at RL = 100 ,
VCC± = ± 5 V
VO = ± 12.5 V Min at RL = 600 ,
VCC± = ± 15 V - Low Supply Current...280 uA Typ
- Decompensated for High Slew Rate and
Gain-Bandwidth Product
AVD = 0.5 Min
Slew Rate = 10 V/us Typ
Gain-Bandwidth Product = 6.5 MHz Typ - Wide Operating Supply Voltage Range
VCC ± = ± 3.5 V to ± 18 V - High Open-Loop Gain...280 V/mV Typ
- Low Offset Voltage...500 uV Max
- Low Offset Voltage Drift With Time
0.04 uV/Month Typ - Low Input Bias Current...5 pA Typ
TLE2161, TLE2161A, TLE2161B
EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE
u POWER OPERATIONAL AMPLIFIERS
SLOS049D - NOVEMBER 1989 - REVISED MAY 1996
The TLE2161, TLE2161A, and TLE2161B are JFET-input, low-power, precision operational amplifiers manufactured using the Texas Instruments Excalibur process. Decompensated for stability with a minimum closed-loop gain of 5, these devices combine outstanding output drive capability with low power consumption, excellent dc precision, and high gain-bandwidth product.
In addition to maintaining the traditional JFET advantages of fast slew rates and low input bias and offset currents, the Excalibur process offers outstanding parametric stability over time and temperature. This results in a device that remains precise even with changes in temperature and over years of use.
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2161ACDR).
A variety of available options includes small-outline packages and chip-carrier versions for high-density system applications.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized for operation from -40°C to 85°C. The M-suffix devices are characterized for operation over the full military temperature range of -55°C to 125°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Excalibur JFET-Input High-Output-Drive Micro Power Operational Amplifiers datasheet (Rev. D) | 1996/05/01 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치