홈 데이터 컨버터 디지털-아날로그 컨버터(DAC) 정밀 DAC(≤10 MSPS)
홈
데이터 컨버터
디지털-아날로그 컨버터(DAC)
정밀 DAC(≤10 MSPS)

TLV5619

활성

12비트, 단일 채널 DAC, 병렬, 전압 출력, 저전력, 비동기 업데이트

지금 주문
데이터 시트

이 제품의 최신 버전이 있습니다

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
DAC60501 활성 정밀 내부 레퍼런스가 포함된 WSON 패키지의 진정한 12비트, 1채널, SPI/I2C, 전압 출력 DAC Smaller 2.5mm × 2.5mm package with integrated reference

TLV5619

활성
데이터 시트 지금 주문

제품 상세 정보

Resolution (Bits) 12 Number of DAC channels 1 Interface type Parallel Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 4 Settling time (µs) 1 Reference type Ext Architecture String Rating Automotive, Catalog Sample/update rate (Msps) 1 Power consumption (typ) (mW) 4.3 Operating temperature range (°C) -40 to 85 Product type General-purpose DAC
Resolution (Bits) 12 Number of DAC channels 1 Interface type Parallel Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 4 Settling time (µs) 1 Reference type Ext Architecture String Rating Automotive, Catalog Sample/update rate (Msps) 1 Power consumption (typ) (mW) 4.3 Operating temperature range (°C) -40 to 85 Product type General-purpose DAC
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Single Supply 2.7-V to 5.5-V Operation
  • ±0.4 LSB Differential Nonlinearity (DNL),
    ±1.5 LSB Integral Nonlinearity (INL)
  • 12-Bit Parallel Interface
  • Compatible With TMS320 DSP
  • Internal Power On Reset
  • Settling Time 1 µs Typ
  • Low Power Consumption:
    • 8 mW for 5-V Supply
    • 4.3 mW for 3-V Supply
  • Reference Input Buffers
  • Voltage Output
  • Monotonic Over Temperature
  • Asynchronous Update
  • APPLICATIONS
    • Battery Powered Test Instruments
    • Digital Offset and Gain Adjustment
    • Battery Operated/Remote Industrial Controls
    • Machine and Motion Control Devices
    • Cordless and Wireless Telephones
    • Speech Synthesis
    • Communication Modulators
    • Arbitrary Waveform Generation
  • Single Supply 2.7-V to 5.5-V Operation
  • ±0.4 LSB Differential Nonlinearity (DNL),
    ±1.5 LSB Integral Nonlinearity (INL)
  • 12-Bit Parallel Interface
  • Compatible With TMS320 DSP
  • Internal Power On Reset
  • Settling Time 1 µs Typ
  • Low Power Consumption:
    • 8 mW for 5-V Supply
    • 4.3 mW for 3-V Supply
  • Reference Input Buffers
  • Voltage Output
  • Monotonic Over Temperature
  • Asynchronous Update
  • APPLICATIONS
    • Battery Powered Test Instruments
    • Digital Offset and Gain Adjustment
    • Battery Operated/Remote Industrial Controls
    • Machine and Motion Control Devices
    • Cordless and Wireless Telephones
    • Speech Synthesis
    • Communication Modulators
    • Arbitrary Waveform Generation

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.
filter 기타 정밀 DAC(≤10 MSPS) 찾기
다운로드

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
1개 모두 보기
유형 직함 날짜
* Data sheet TLV5619 - 2.7 V To 5.5 V 12-Bit Parallel DAC With Power Down datasheet (Rev. F) 2004/02/29

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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