TMP113
- Available in WCSP package:
- Body size (DSBGA-6): 1.5 × 1.0 × 0.525mm
- Wide operating ranges
- V+ operating range: 1.4V to 5.5V
- Temperature range: -40°C to 125°C
- Accuracy holds across temperature
- ±0.1°C (typical) at 25°C
- ±0.3°C (maximum) from -25°C to 85°C
- ±0.5°C (maximum) from -40°C to 125°C
- 12-bit resolution: 0.0625°C (LSB)
- Flexible digital interface
- I2C and SMBus compatible
- I3C Mixed Bus co-existence capable
- Low supply current
- 3.4µA Average current (typical) at 4Hz
- 1.4µA Average current (typical) at 1Hz
- 70nA Shutdown current (typical)
- Only 2m°C/V DC power supply rejection over wide supply range of 1.4V to 5.5V
- Safety and compliance
- NIST Traceable
- Software compatible with normal mode of Industry-Standard
-
Available compatible dual source device in the market
The TMP113 is a I2C-compatible digital temperature sensor in a 6-pin WCSP-package. The TMP113 offers an accuracy of ±0.3°C across the -25°C to 85°C temperature range with an on-chip 12-bit analog-to-digital converter (ADC) that provides a temperature resolution of 0.0625°C.
The TMP113 is designed to operate from a supply range as low as 1.4V, with a low average and shutdown current of 1.4µA (at 1Hz) and 70nA, allowing for an on-demand temperature conversion and maximizing of battery life. At the same time the supply can be raised to as high as 5.5V for a range of industrial applications with only 2m°C/V DC power supply rejection. This device has a very fast thermal step response equal to 0.2s with flexible PCB.
The TMP113 production units are 100% tested against sensors that are NIST-traceable and are verified with equipment that are NIST-traceable through ISO/IEC 17025 accredited calibrations.
Similar devices in terms of software are available.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TMP113EVM — TMP113 evaluation module
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YBG) | 6 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치