TMP175-Q1

활성

오토모티브 임시 산업 표준 LM75 폼 팩터 및 핀아웃의 27 I2C/SMBus 주소를 지원하는 센서

제품 상세 정보

Local sensor accuracy (max) 1.5 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 2.7 Interface type I2C, SMBus Supply voltage (max) (V) 5.5 Features ALERT, One-shot conversion Supply current (max) (µA) 85 Temp resolution (max) (bps) 12 Remote channels (#) 0 Addresses 27 Rating Automotive
Local sensor accuracy (max) 1.5 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 2.7 Interface type I2C, SMBus Supply voltage (max) (V) 5.5 Features ALERT, One-shot conversion Supply current (max) (µA) 85 Temp resolution (max) (bps) 12 Remote channels (#) 0 Addresses 27 Rating Automotive
SOIC (D) 8 29.4 mm² 4.9 x 6 VSSOP (DGK) 8 14.7 mm² 3 x 4.9
  • AEC-Q100 Qualified with:
    • Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range
    • HBM ESD Classification Level 2
    • CDM ESD Classification Level C6
  • TMP175-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±2°C (Maximum) from –40°C to +125°C
  • TMP75-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±3°C (Maximum) from –40°C to +125°C
  • TMP175-Q1: 27 Addresses
  • TMP75-Q1: 8 Addresses, NIST Traceable
  • Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
  • Resolution: 9 to 12 Bits, User-Selectable
  • Low Quiescent Current: 50-µA, 0.1-µA Standby
  • Wide Supply Range: 2.7 V to 5.5 V
  • Small 8-Pin VSSOP and 8-Pin SOIC Packages
  • AEC-Q100 Qualified with:
    • Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range
    • HBM ESD Classification Level 2
    • CDM ESD Classification Level C6
  • TMP175-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±2°C (Maximum) from –40°C to +125°C
  • TMP75-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±3°C (Maximum) from –40°C to +125°C
  • TMP175-Q1: 27 Addresses
  • TMP75-Q1: 8 Addresses, NIST Traceable
  • Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
  • Resolution: 9 to 12 Bits, User-Selectable
  • Low Quiescent Current: 50-µA, 0.1-µA Standby
  • Wide Supply Range: 2.7 V to 5.5 V
  • Small 8-Pin VSSOP and 8-Pin SOIC Packages

The TMP75-Q1 and TMP175-Q1 devices are digital temperature sensors ideal for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit, analog-to-digital converter (ADC) offers resolutions down to 0.0625°C. The devices are available in the industry-standard, LM75, 8-pin SOIC and VSSOP footprint.

The TMP175-Q1 and TMP75-Q1 feature SMBus, two-wire, and I2C interface compatibility. The TMP175-Q1 device allows up to 27 devices on one bus. The TMP75-Q1 allows up to eight devices on one bus. The TMP175-Q1 and TMP75-Q1 both feature an SMBus alert function.

The TMP175-Q1 and TMP75-Q1 devices are ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The TMP75-Q1 production units are 100% tested against sensors that are NIST-traceable and are verified with equipment that are NIST-traceable through ISO/IEC 17025 accredited calibrations.

The TMP175-Q1 and TMP75-Q1 devices are specified for operation over the temperature range of –40°C to +125°C.

The TMP75-Q1 and TMP175-Q1 devices are digital temperature sensors ideal for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit, analog-to-digital converter (ADC) offers resolutions down to 0.0625°C. The devices are available in the industry-standard, LM75, 8-pin SOIC and VSSOP footprint.

The TMP175-Q1 and TMP75-Q1 feature SMBus, two-wire, and I2C interface compatibility. The TMP175-Q1 device allows up to 27 devices on one bus. The TMP75-Q1 allows up to eight devices on one bus. The TMP175-Q1 and TMP75-Q1 both feature an SMBus alert function.

The TMP175-Q1 and TMP75-Q1 devices are ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The TMP75-Q1 production units are 100% tested against sensors that are NIST-traceable and are verified with equipment that are NIST-traceable through ISO/IEC 17025 accredited calibrations.

The TMP175-Q1 and TMP75-Q1 devices are specified for operation over the temperature range of –40°C to +125°C.

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기술 자료

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유형 직함 날짜
* Data sheet TMPx75-Q1 Automotive Grade Temperature Sensor With I2C and SMBus Interface in Industry-Standard LM75 Form Factor and Pinout datasheet PDF | HTML 2015/11/18
Application note LM75B and TMP1075 Industry-Standard Devices: Design Guidelines and Spec Comparison (Rev. A) PDF | HTML 2024/03/07
Technical article How to maximize powertrain efficiency and reliability with high-accuracy temperatu PDF | HTML 2021/05/10
Application note Applying I2C-Compatible Temperature Sensors in Systems With Slow Clock Edges (Rev. A) 2013/05/06

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

드라이버 또는 라이브러리

LM75SW-LINUX — I2C 온도 센서용 Linux 드라이버

The Linux driver support LM75 compatible Temperature Sensors. The Linux driver supports communication through the I2C bus and interfaces with the Hardware Monitoring sub-system.
Linux Mainline Status

Available in Linux Main line: Yes
Available through git.ti.com: N/A

Supported Devices:
  • LM75A
  • TMP100
  • TMP101
  • (...)
시뮬레이션 모델

TMP175 IBIS Model

SLOM203.ZIP (22 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
SOIC (D) 8 Ultra Librarian
VSSOP (DGK) 8 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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