TMP275-Q1
- AEC-Q100 Qualified with:
- Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range
- HBM ESD Classification Level 2
- CDM ESD Classification Level C6
- High Accuracy:
- ±0.75°C (Maximum) from −10°C to +85°C
- ±1.5°C (Maximum) from −40°C to +125°C
- Low Quiescent Current:
- 50 µA (Typical)
- 0.1 µA (Standby)
- Resolution: 9 to 12 Bits, User-Selectable
- Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
- 8 I2C, SMBus Addresses
- Wide Supply Range: 2.7 V to 5.5 V
- Small 8-Pin VSSOP and SOIC Packages
- No Specified Power-Up Sequence Required, Two-Wire Bus Pullups Can Be Enabled Before V+
The TMP275-Q1 is a ±0.75°C, accurate integrated digital temperature sensor with a 12-bit, analog-to-digital converter (ADC) that can operate on a supply voltage as low as 2.7 V and is pin- and register-compatible with the Texas Instruments LM75, TMP75, TMP75B, and TMP175 devices. The TMP275-Q1 device is available in 8-pin SOIC and VSSOP packages and requires no external components to sense temperature. The device is capable of reading temperatures with a maximum resolution of 0.0625°C (12 bits) and as low as 0.5°C (9 bits), thus allowing the user to maximize efficiency by programming for higher resolution or faster conversion time. The device is specified over the temperature range of –40°C to +125°C.
The TMP275-Q1 device features SMBus and two-wire interface compatibility and allows up to eight devices on the same bus with the SMBus overtemperature alert function. The factory-calibrated temperature accuracy and the noise-immune digital interface make the TMP275-Q1 the preferred solution for temperature compensation of other sensors and electronic components, without the need for additional system-level calibration or elaborate board layout for distributed temperature sensing.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMP275-Q1 Automotive Grade ±0.75°C Temperature Sensor with I2C and SMBus Interface in Industry-Standard LM75 Form Factor and Pinout datasheet (Rev. B) | PDF | HTML | 2017/04/26 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치