전원 관리 전원 스위치 부하 스위치

상승 시간 및 히스테리시스 조정 가능 8V, 3A, 44mΩ 부하 스위치

제품 상세 정보

Number of channels 1 Vin (min) (V) 1.2 Vin (max) (V) 8 Imax (A) 3 Ron (typ) (mΩ) 41 Shutdown current (ISD) (typ) (µA) 0.15 Soft start Adjustable Rise Time Current limit type None Rating Catalog Operating temperature range (°C) -40 to 125 FET Internal Device type Load switches
Number of channels 1 Vin (min) (V) 1.2 Vin (max) (V) 8 Imax (A) 3 Ron (typ) (mΩ) 41 Shutdown current (ISD) (typ) (µA) 0.15 Soft start Adjustable Rise Time Current limit type None Rating Catalog Operating temperature range (°C) -40 to 125 FET Internal Device type Load switches
SOT-23-THN (DDC) 6 8.12 mm² 2.9 x 2.8
  • Low ON-Resistance, High Current PFET
    • RON = 32 mΩ (Typical) at VGS = –4.5 V
    • RON = 44 mΩ (Typical) at VGS = –3.0 V
    • RON = 85 mΩ (Typical) at VGS = –1.8 V
    • RON = 97 mΩ (Typical) at VGS = –1.5 V
    • RON = 155 mΩ (Typical) at VGS = –1.2 V
  • Configurable Turn-ON and Turn-OFF Slew Rate
    • 10-µs Default Minimum Output Rise Time at VIN=5 V
  • ConfigurableTurnon and Turnoff Slew Rate
  • Supports a Wide Range of VIN 1.2 V Up to 8 V
  • Excellent OFF Isolation Even Under Fast Input Transients
  • 1.0V up to 8V NMOS Control Logic Interface With Configurable Hystersis
  • Fully Protected Against ESD (All Pins)
    • HBM 2000 V, CDM 500 V
  • Very Low ON-state Quiescent Current (Down to 1.2 µA)
  • Very Low OFF-state Leakage Current (Typical 100 nA)
  • Available in 2.9 mm × 1.6 mm × 0.75 mm SOT-23 (DDC) Package
  • Low ON-Resistance, High Current PFET
    • RON = 32 mΩ (Typical) at VGS = –4.5 V
    • RON = 44 mΩ (Typical) at VGS = –3.0 V
    • RON = 85 mΩ (Typical) at VGS = –1.8 V
    • RON = 97 mΩ (Typical) at VGS = –1.5 V
    • RON = 155 mΩ (Typical) at VGS = –1.2 V
  • Configurable Turn-ON and Turn-OFF Slew Rate
    • 10-µs Default Minimum Output Rise Time at VIN=5 V
  • ConfigurableTurnon and Turnoff Slew Rate
  • Supports a Wide Range of VIN 1.2 V Up to 8 V
  • Excellent OFF Isolation Even Under Fast Input Transients
  • 1.0V up to 8V NMOS Control Logic Interface With Configurable Hystersis
  • Fully Protected Against ESD (All Pins)
    • HBM 2000 V, CDM 500 V
  • Very Low ON-state Quiescent Current (Down to 1.2 µA)
  • Very Low OFF-state Leakage Current (Typical 100 nA)
  • Available in 2.9 mm × 1.6 mm × 0.75 mm SOT-23 (DDC) Package

The TPS27082L IC is a high-side load switch that integrates a Power PFET and a control circuit in a tiny TSOT-23 package. TPS27082L requires very low ON-state quiescent current and offers very low OFF-state leakage thus optimizing system power efficiency.

TPS27082L ON/OFF logic interface features hysteresis, thus providing a robust logic interface even under very noisy operating conditions. TPS27082L ON/OFF interface supports direct interfacing to low voltage GPIOs down to 1 V. The TPS27082L level shifts ON/OFF logic signal to VIN levels without requiring an external level shifter.

TPS27082L features a novel OFF isolation circuit that prevents PMOS from turning ON in applications that may have fast transients, at the VIN pin when the load switch is in the OFF-state.

The TPS27082L IC is a high-side load switch that integrates a Power PFET and a control circuit in a tiny TSOT-23 package. TPS27082L requires very low ON-state quiescent current and offers very low OFF-state leakage thus optimizing system power efficiency.

TPS27082L ON/OFF logic interface features hysteresis, thus providing a robust logic interface even under very noisy operating conditions. TPS27082L ON/OFF interface supports direct interfacing to low voltage GPIOs down to 1 V. The TPS27082L level shifts ON/OFF logic signal to VIN levels without requiring an external level shifter.

TPS27082L features a novel OFF isolation circuit that prevents PMOS from turning ON in applications that may have fast transients, at the VIN pin when the load switch is in the OFF-state.

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기술 자료

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* Data sheet TPS27082L 1.2-V to 8-V, 3-A PFET Load Switch With Configurable Slew Rate, Fast Transient Isolation and Hysteretic Control datasheet (Rev. C) PDF | HTML 2015/06/30

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치