TPS62743
- Input voltage range VIN from 2.15 V to 5.5 V
- Input voltage range down to 2.0 V once started
- output current
- TPS62743 300 mA
- TPS627431 400 mA
- 360-nA operational quiescent current
- Up to 90% efficiency at 10-µA output current
- Power save mode operation
- Selectable output voltages
- Eight voltage options between 1.2 V to 3.3 V
- Output voltage discharge
- Low output voltage ripple
- Automatic transition to no ripple 100% mode
- RF friendly DCS-Control™
- Total solution size < 10 mm2
- Small 1.6-mm × 0.9-mm, 8-ball WCSP package
The TPS62743 is a high efficiency step down converter with ultra low quiescent current of typical 360 nA. The device is optimized to operate with a 2.2-µH inductor and 10µF output capacitor. The device uses DCS-Control™ and operates with a typical switching frequency of 1.2 MHz. In Power Save Mode the device extends the light load efficiency down to a load current range of 10-µA and below. TPS62743 provides an output current of 300 mA. Once started the device operates down to an input voltage range of 2.0 V. This allows to operate the device directly from a single Li-MnO2 coin cell.
The TPS62743 provides 8 programmable output voltages between 1.2V and 3.3V selectable by three selection pins. The TPS62743 is optimized to provide a low output voltage ripple and low noise using a small output capacitor. Once the input voltage comes close to the output voltage the device enters the No Ripple 100% mode to prevent an increase of output ripple voltage. In this operation mode the device stops switching and turns the high side MOSFET switch on.
기술 자료
설계 및 개발
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TPS62743EVM-689 — TPS62743 초저 Iq 스텝다운 컨버터 평가 모듈
The TPS62743EVM-689 is designed to help the user easily evaluate and test the operation and functionality of the TPS62743. The EVM converts a 2.0-V to 5.5-V input voltage to a regulated output that is set between 1.2 V and 3.3 V at up to 300 mA. The TPS62743 comes in a small 1.6 x 0.9 mm² WCSP (...)
PMP11311 — bq51003 및 bq25120을 사용한 무선 충전이 가능한 웨어러블 장치용 전원 레퍼런스 설계
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YFP) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치