TWL1200-Q1
- Qualified for Automotive Applications
- AEC-Q100 Test Guidance With the Following Results:
- Device Temperature Grade 3: –40°C to +85°C
Ambient Operating Temperature Range - Device HBM ESD Classification Level H1C
- Device CDM ESD Classification Level C3B
- Device Temperature Grade 3: –40°C to +85°C
- Level Translator
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility Gap
Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273) - Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.
The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | SDIO, UART, and Audio Voltage-Translation Transceiver, TWL1200-Q1 datasheet (Rev. A) | 2012/04/28 | |
| Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024/07/12 | |
| Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024/07/03 | |
| Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021/04/15 | ||
| More literature | Automotive Logic Devices Brochure | 2014/08/27 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TQFP (PFB) | 48 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치