TX7316

활성

전송 빔포머가 통합된 16채널 3레벨 또는 8채널 5레벨 트랜스미터

제품 상세 정보

Device type Transmitter Number of input channels 16 Active supply current (typ) (mA) 3.6 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
Device type Transmitter Number of input channels 16 Active supply current (typ) (mA) 3.6 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
NFBGA (ZCX) 216 150 mm² 15 x 10
  • Transmitter supports:
    • 16-channel 3-level or 8-channel 5-level pulser and active transmit/receive (T/R) switch
    • Very low power on-chip beamforming mode (5-level mode):
      • In receive-only mode: 17 mW
      • In transmit-receive mode: 598 mW
      • In CW mode (0.6-A mode): 1.97 W
      • In global power-down mode: 4.3 mW
  • 3-level, 5-level pulser:
    • Maximum output voltage: ±100 V
    • Minimum output voltage: ±1 V
    • Maximum output current: 2.4 A to 0.6 A
    • Maximum clamp current: 1 A to 0.25 A (in 3-level mode)
    • Maximum clamp current: 2 A to 0.5 A (in 5-level mode)
    • Second harmonic of –45 dBc at 5 MHz
    • CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
    • CW mode close-in phase noise: –154 dBc/Hz at 1 kHz offset for 5 MHz signal
    • Supports 4.8-A mode in 5-level mode
    • –3-dB Bandwidth with 1-kΩ || 240-pF load
      • 20 MHz (For ±100-V supply in 2.4-A mode)
      • 36 MHz (For ±100-V supply in 4.8-A mode)
      • 25 MHz (For ±70-V supply in 2.4-A mode)
  • Active transmit/receive (T/R) switch with:
    • ON/OFF control signal
    • Turnon resistance of 12 Ω
    • Bandwidth: 50 MHz
    • HD2: -50 dBc
    • Turnon time: 0.5 µs
    • Turnoff time: 1.75 µs
    • Transient glitch: 50 mVPP
  • Off-chip beam former with:
    • Jitter cleaning using synchronization feature
    • Maximum synchronization clock frequency: 200 MHz
  • On-chip beam former with:
    • Delay resolution: one beamformer clock period, minimum 5 ns
    • Maximum delay: 213 beamformer clock period
    • Maximum beamformer clock speed: 200 MHz
    • On-chip RAM to store
      • 16 Delay profiles
      • 48/28 pattern-profiles for 3- or 5-level mode
  • High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
  • Automatic thermal shutdown
  • No specific power sequencing requirement in 3-level mode
  • Small package: NFBGA-216 (15 mm × 10 mm) with 0.8-mm pitch
  • Transmitter supports:
    • 16-channel 3-level or 8-channel 5-level pulser and active transmit/receive (T/R) switch
    • Very low power on-chip beamforming mode (5-level mode):
      • In receive-only mode: 17 mW
      • In transmit-receive mode: 598 mW
      • In CW mode (0.6-A mode): 1.97 W
      • In global power-down mode: 4.3 mW
  • 3-level, 5-level pulser:
    • Maximum output voltage: ±100 V
    • Minimum output voltage: ±1 V
    • Maximum output current: 2.4 A to 0.6 A
    • Maximum clamp current: 1 A to 0.25 A (in 3-level mode)
    • Maximum clamp current: 2 A to 0.5 A (in 5-level mode)
    • Second harmonic of –45 dBc at 5 MHz
    • CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
    • CW mode close-in phase noise: –154 dBc/Hz at 1 kHz offset for 5 MHz signal
    • Supports 4.8-A mode in 5-level mode
    • –3-dB Bandwidth with 1-kΩ || 240-pF load
      • 20 MHz (For ±100-V supply in 2.4-A mode)
      • 36 MHz (For ±100-V supply in 4.8-A mode)
      • 25 MHz (For ±70-V supply in 2.4-A mode)
  • Active transmit/receive (T/R) switch with:
    • ON/OFF control signal
    • Turnon resistance of 12 Ω
    • Bandwidth: 50 MHz
    • HD2: -50 dBc
    • Turnon time: 0.5 µs
    • Turnoff time: 1.75 µs
    • Transient glitch: 50 mVPP
  • Off-chip beam former with:
    • Jitter cleaning using synchronization feature
    • Maximum synchronization clock frequency: 200 MHz
  • On-chip beam former with:
    • Delay resolution: one beamformer clock period, minimum 5 ns
    • Maximum delay: 213 beamformer clock period
    • Maximum beamformer clock speed: 200 MHz
    • On-chip RAM to store
      • 16 Delay profiles
      • 48/28 pattern-profiles for 3- or 5-level mode
  • High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
  • Automatic thermal shutdown
  • No specific power sequencing requirement in 3-level mode
  • Small package: NFBGA-216 (15 mm × 10 mm) with 0.8-mm pitch

The TX7316 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 16 pulser circuits (PULS), 16 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

The TX7316 (referred to as device in this data sheet) has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 8 outputs for 5-level mode and 16 outputs for 3-level mode. The maximum output current is configurable from 2.4 A to 0.6 A.

A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 12-Ω impedance in the ON state.

Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7316 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation.

In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal.

In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 48/28 pattern profiles for 3/5-level mode can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device.

TX7316 is available in a 15-mm × 10-mm 216-pin NFBGA package (ZCX package) and is specified for operation from 0°C to 70°C.

The TX7316 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 16 pulser circuits (PULS), 16 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

The TX7316 (referred to as device in this data sheet) has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 8 outputs for 5-level mode and 16 outputs for 3-level mode. The maximum output current is configurable from 2.4 A to 0.6 A.

A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 12-Ω impedance in the ON state.

Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7316 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation.

In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal.

In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 48/28 pattern profiles for 3/5-level mode can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device.

TX7316 is available in a 15-mm × 10-mm 216-pin NFBGA package (ZCX package) and is specified for operation from 0°C to 70°C.

다운로드 스크립트와 함께 비디오 보기 동영상
추가 정보 요청

전체 데이터 시트 및 기타 설계 리소스를 사용할 수 있습니다. 지금 액세스 요청

관심 가지실만한 유사 제품

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TX7516 활성 16채널 5 레벨 트랜스미터 Three times reduction in size-for-size sensitive applications

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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3개 모두 보기
유형 직함 날짜
* Data sheet TX7316 Three-Level, 16-Channel or Five-Level, 8-Channel Transmitter With 2.4-A Pulser, T/R Switch, and Integrated Transmit Beamformer datasheet (Rev. B) PDF | HTML 2019/07/02
Application note Designing High Voltage Power Supply for Ultrasound Smart Probes (Rev. A) PDF | HTML 2023/05/16
EVM User's guide TX7316EVM Evaluation Module User's Guide (Rev. A) 2019/05/24

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TX7316EVM — TX7316 16채널 3레벨 또는 8채널 5레벨 트랜스미터 평가 모듈

TX7316 평가 모듈(EVM)은 TX7316 장치와 그 기능을 평가합니다.
사용 설명서: PDF
시뮬레이션 툴

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TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
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NFBGA (ZCX) 216 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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