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Noninverting buffers & drivers

SN74ABT162244

ACTIVE

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

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Data sheet

SN74ABT162244

ACTIVE
Data sheet Order now

Product details

Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 30000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 30000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments Widebus™ Family
  • Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • Typical VOLP (Output Ground Bounce) <1 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD-17

Widebus is a trademark of Texas Instruments.
  • Members of the Texas Instruments Widebus™ Family
  • Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • Typical VOLP (Output Ground Bounce) <1 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD-17

Widebus is a trademark of Texas Instruments.

The ’ABT162244 devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide noninverting outputs and symmetrical active-low output-enable (OE)\ inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The ’ABT162244 devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide noninverting outputs and symmetrical active-low output-enable (OE)\ inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
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Technical documentation

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Type Title Date
* Data sheet SN54ABT162244, SN74ABT162244 datasheet (Rev. E) 03 Jun 2004
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 Feb 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 Mar 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

HSPICE Model for SN74ABT162244

SCBM098.ZIP (128 KB) - HSpice Model
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Simulation model

SN74ABT162244 Behavioral SPICE Model

SCBM155.ZIP (7 KB) - PSpice Model
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Simulation model

SN74ABT162244 IBIS Model (Rev. C)

SCBM003C.ZIP (15 KB) - IBIS Model
Download
Package Pins CAD symbols, footprints & 3D models
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian
TVSOP (DGV) 48 Ultra Librarian
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