SN74ABT16244A

ACTIVE

Product details

Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 64 Supply current (max) (µA) 34000 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 64 Supply current (max) (µA) 34000 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Drop-in replacement with upgraded functionality to the compared device
SN74AHCT16244 ACTIVE 16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs Larger voltage range (2V to 5.5V)
Pin-for-pin with same functionality to the compared device
SN74LVT16244B ACTIVE 16-ch, 2.7-V to 3.6-V buffers with TTL-compatible CMOS inputs and 3-state outputs Shorter average propagation delay (3ns)
Same functionality with different pin-out to the compared device
SN74LVTH16244A ACTIVE 16-ch, 2.7-V to 3.6-V buffers with TTL-compatible CMOS inputs and 3-state outputs Shorter average propagation delay (3ns)

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 19
Type Title Date
* Data sheet SN54ABT16244, SN74ABT16244A datasheet (Rev. H) 28 Jul 2005
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 Feb 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 Mar 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

SN74ABT16244A Behavioral SPICE Model

SCBM152.ZIP (7 KB) - PSpice Model
Simulation model

SN74ABT16244A IBIS Model (Rev. C)

SCBM005C.ZIP (16 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian
TVSOP (DGV) 48 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos