ESDS302

現行

適用於 USB 和乙太網路且具有 12-A 8/20-uS 突波額定值的雙路 2.3-pF、3.6-V、±30-kV ESD 防護二極體

產品詳細資料

Package name SOT-23 Peak pulse power (8/20 μs) (max) (W) 85 Vrwm (V) 3.6 Bi-/uni-directional Uni-Directional Number of channels 2 IO capacitance (typ) (pF) 2.3 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 12 Features Surge protection Clamping voltage (V) 5.5 Interface type Ethernet, General purpose, USB 2.0 Breakdown voltage (min) (V) 4.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -40 to 125
Package name SOT-23 Peak pulse power (8/20 μs) (max) (W) 85 Vrwm (V) 3.6 Bi-/uni-directional Uni-Directional Number of channels 2 IO capacitance (typ) (pF) 2.3 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (A) 12 Features Surge protection Clamping voltage (V) 5.5 Interface type Ethernet, General purpose, USB 2.0 Breakdown voltage (min) (V) 4.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -40 to 125
SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-4 EFT protection:
    • 80 A (5/50ns)
  • IEC 61000-4-5 surge protection:
    • 12A (8/20µs)
    • Low surge clamping voltage 6V at 12A Ipp
  • IO capacitance:
    • 2.3pF (typical)
  • DC breakdown voltage: 4.5V (minimum)
  • Ultra low leakage current: 3nA (typical)
  • Supports high speed interfaces up to 1 Gbps
  • Industrial temperature range: –40°C to +125°C
  • Easy flow-through routing package (ESDS302)
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-4 EFT protection:
    • 80 A (5/50ns)
  • IEC 61000-4-5 surge protection:
    • 12A (8/20µs)
    • Low surge clamping voltage 6V at 12A Ipp
  • IO capacitance:
    • 2.3pF (typical)
  • DC breakdown voltage: 4.5V (minimum)
  • Ultra low leakage current: 3nA (typical)
  • Supports high speed interfaces up to 1 Gbps
  • Industrial temperature range: –40°C to +125°C
  • Easy flow-through routing package (ESDS302)

The ESDS302, ESDS304 devices are uni-directional TVS ESD protection diode array in two and four channel configurations respectively, for Ethernet and USB surge protection up to 12A (8/20µs). The ESDS302, ESDS304 devices are rated to dissipate ESD strikes up to 30kV per the IEC 61000-4-2 international standard (> Level 4).

The devices features a 2.3pF IO capacitance per channel making it an excellent choice for protecting high-speed interfaces such as Ethernet™ 1G and USB 2.0. The low dynamic resistance and low clamping voltage provides system level protection against transient events.

The ESDS302, ESDS304 devices are offered in the industry standard 5-pin SOT23 packages.

The ESDS302, ESDS304 devices are uni-directional TVS ESD protection diode array in two and four channel configurations respectively, for Ethernet and USB surge protection up to 12A (8/20µs). The ESDS302, ESDS304 devices are rated to dissipate ESD strikes up to 30kV per the IEC 61000-4-2 international standard (> Level 4).

The devices features a 2.3pF IO capacitance per channel making it an excellent choice for protecting high-speed interfaces such as Ethernet™ 1G and USB 2.0. The low dynamic resistance and low clamping voltage provides system level protection against transient events.

The ESDS302, ESDS304 devices are offered in the industry standard 5-pin SOT23 packages.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 7
類型 標題 日期
* Data sheet ESDS30x Data-Line Surge and ESD Protection Devices for High Speed Interfaces datasheet (Rev. B) PDF | HTML 2024年 1月 31日
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 2024年 1月 11日
Selection guide System-Level ESD Protection Guide (Rev. D) 2022年 9月 7日
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022年 8月 18日
Application note IEEE 802.3cg 10BASE-T1L Power over Data Lines Powered Device Design (Rev. A) PDF | HTML 2022年 6月 2日
Application note Protecting Ethernet Ports from Surge Events (Rev. A) PDF | HTML 2022年 4月 27日
White paper Demystifying surge protection 2018年 11月 6日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

ESDEVM — ESD 評估模組

靜電敏感裝置 (ESD) 評估模組 (EVM) 是我們大多數 ESD 產品組合的開發平台。此電路板配備所有傳統 ESD 元件封裝,可測試任意數量的裝置。裝置可以焊接到其相應的元件封裝上,然後進行測試。對於一般高速 ESD 二極體,會實作阻抗控制的配置以取得 S 參數並取消內嵌電路板軌跡。對於非高速 ESD 二極體,其元件封裝會包含連接至測試點的軌跡,讓您輕鬆執行 DC 測試,例如崩潰電壓、保持電壓、洩漏等。電路板配置也可以透過將訊號針腳短路到訊號所在的任何地方,讓任何裝置針腳都能輕鬆地連接到電源 (VCC) 或接地。
使用指南: PDF | HTML
TI.com 無法提供
模擬型號

ESDS302 S-Parameter Model

SLVMCT0.ZIP (37 KB) - S-Parameter Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SOT-23 (DBV) 5 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片