LMC6032
- Specified for 2kΩ and 600Ω loads
- High voltage gain: 126dB, 2kΩ
- Low offset voltage drift: 2.3µV/°C
- Ultra-low input bias current: 40fA
- Input common-mode range includes V−
- Operates on standard 5V and 15V supplies
- IQ = 375µA/amplifier; independent of V+
- Low noise: 22nV/√Hz
- Slew rate: 1.1V/µs
- Improved performance over TLC272
The dual LMC6032 and quad LMC6034 (LMC603x) are CMOS operational amplifiers that operate from either a single supply or dual supplies. Device performance features include an input common-mode range that reaches ground, low input bias current, and high voltage gain into realistic loads, such as 2kΩ and 600Ω.
This chip is built with TIs advanced CMOS process.
For higher-performance characteristics, see the OPA928.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMC603x CMOS Dual Operational Amplifiers datasheet (Rev. D) | PDF | HTML | 2024年 2月 28日 |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
DUAL-DIYAMP-EVM — 雙通道通用自製 (DIY) 放大器電路評估模組
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點