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TLV9104 現行 四通道、16-V、1.1-MHz、低功耗 (0.12 mA) 運算放大器 Pin-to-pin upgrade with improved performance: lower Vos(1.5mV), higher slew rate(4.5V/us) and output current(80mA)

產品詳細資料

Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 15.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4.75 Rail-to-rail In to V-, Out GBW (typ) (MHz) 1.4 Slew rate (typ) (V/µs) 1.1 Vos (offset voltage at 25°C) (max) (mV) 3 Iq per channel (typ) (mA) 0.38 Vn at 1 kHz (typ) (nV√Hz) 22 Rating Catalog Operating temperature range (°C) -40 to 85 Offset drift (typ) (µV/°C) 1.3 Input bias current (max) (pA) 2 CMRR (typ) (dB) 83 Iout (typ) (A) 0.021 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.4 Input common mode headroom (to positive supply) (typ) (V) -1.9 Output swing headroom (to negative supply) (typ) (V) 0.1 Output swing headroom (to positive supply) (typ) (V) -0.13
Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 15.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4.75 Rail-to-rail In to V-, Out GBW (typ) (MHz) 1.4 Slew rate (typ) (V/µs) 1.1 Vos (offset voltage at 25°C) (max) (mV) 3 Iq per channel (typ) (mA) 0.38 Vn at 1 kHz (typ) (nV√Hz) 22 Rating Catalog Operating temperature range (°C) -40 to 85 Offset drift (typ) (µV/°C) 1.3 Input bias current (max) (pA) 2 CMRR (typ) (dB) 83 Iout (typ) (A) 0.021 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.4 Input common mode headroom (to positive supply) (typ) (V) -1.9 Output swing headroom (to negative supply) (typ) (V) 0.1 Output swing headroom (to positive supply) (typ) (V) -0.13
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6
  • Rail-to-rail output swing
  • Specified for 2kΩ and 600Ω loads
  • High voltage gain: 126dB
  • Low input offset voltage: 3mV
  • Low offset voltage drift: 1.3µV/°C
  • Ultra low input bias current: 2fA
  • Low voltage noise: 22nV/√Hz
  • Input common-mode range includes V−
  • Operating range from 4.75V to 15.5V supply
  • ISS = 400µA/amplifier; Independent of V+
  • Slew rate: 1.1V/µs
  • Rail-to-rail output swing
  • Specified for 2kΩ and 600Ω loads
  • High voltage gain: 126dB
  • Low input offset voltage: 3mV
  • Low offset voltage drift: 1.3µV/°C
  • Ultra low input bias current: 2fA
  • Low voltage noise: 22nV/√Hz
  • Input common-mode range includes V−
  • Operating range from 4.75V to 15.5V supply
  • ISS = 400µA/amplifier; Independent of V+
  • Slew rate: 1.1V/µs

The dual LMC662 and quad LMC660 (LMC66x) are CMOS operational amplifiers designed for operation from a single supply, and built with TI’s advanced CMOS process. The device operates from 5V to 15V and features rail-to-rail output swing in addition to an input common-mode range that includes ground. Performance limitations that have plagued CMOS amplifiers in the past are not a problem with this design. Input offset voltage (VOS), offset drift, and broadband noise as well as voltage gain into realistic loads (2kΩ and 600Ω) are all equal to or better than widely accepted bipolar equivalents.

The dual LMC662 and quad LMC660 (LMC66x) are CMOS operational amplifiers designed for operation from a single supply, and built with TI’s advanced CMOS process. The device operates from 5V to 15V and features rail-to-rail output swing in addition to an input common-mode range that includes ground. Performance limitations that have plagued CMOS amplifiers in the past are not a problem with this design. Input offset voltage (VOS), offset drift, and broadband noise as well as voltage gain into realistic loads (2kΩ and 600Ω) are all equal to or better than widely accepted bipolar equivalents.

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類型 標題 日期
* Data sheet LMC66x CMOS Dual Operational Amplifiers datasheet (Rev. D) PDF | HTML 2024年 2月 28日
E-book The Signal e-book: A compendium of blog posts on op amp design topics 2017年 3月 28日
Application note AN-856 A SPICE Comp Macromodel for CMOS Op Amplifiers (Rev. C) 2013年 5月 6日
Application note Effect of Heavy Loads on Accuracy and Linearity of Op Amp Circuits (Rev. B) 2013年 4月 22日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

AMP-PDK-EVM — 放大器性能開發套件評估模組

放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。

AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:

  • D (SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV (SOT23-5 和 SOT23-6)
  • DCK (SC70-5 和 SC70-6)
使用指南: PDF | HTML
模擬型號

LMC660 PSPICE Model

SNOM169.ZIP (3 KB) - PSpice Model
計算工具

ANALOG-ENGINEER-CALC — 類比工程師計算機

The Analog Engineer’s Calculator is designed to speed up many of the repetitive calculations that analog circuit design engineers use on a regular basis. This PC-based tool provides a graphical interface with a list of various common calculations ranging from setting op-amp gain with feedback (...)
設計工具

CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器

此設計可反轉輸入訊號 VIN,並使用 1000 V/V 或 60 dB 訊號增益。具有 T 回饋網路的反相放大器可在沒有較小 R4 值或超大回饋電阻器值的情況下獲得高增益。
設計工具

CIRCUIT060015 — 可調式參考電壓電路

此電路結合反相及非反相放大器,讓參考電壓可從負輸入電壓向上調整至輸入電壓。可加入增益以提高最大負參考位準。
設計工具

CIRCUIT060074 — 具有比較器電路的高壓側電流感測

此高壓側電流感測解決方案使用一個具有軌對軌輸入共模範圍的比較器,若負載電流上升到 1 A 以上,便在比較器輸出 (COMP OUT) 建立過電流警示 (OC 警示) 訊號。此實作中的 OC 訊號為低電位作動。因此當超過 1-A 閾值時,比較器輸出會變低。實作磁滯後會在負載電流降低至 0.5 A (減少 50%) 時,讓 OC-Alert 返回邏輯高狀態。此電路利用開漏輸出比較器,為控制數位邏輯輸入針腳而進行電平轉換輸出高邏輯電平。對於需要驅動 MOSFET 開關閘極的應用,建議使用具推挽輸出的比較器。
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
PDIP (N) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian

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  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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