SN65DSI84-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature
- Device HBM ESD Classification Level 3A
- Device CDM ESD Classification Level C6
- Implements MIPI D-PHY Version 1.00.00 Physical Layer Front-End and Display Serial Interface (DSI) Version 1.02.00
- Single-Channel DSI Receiver Configurable for One, Two, Three, or Four D-PHY Data Lanes Per Channel Operating up to 1 Gbps Per Lane
- Supports 18-bpp and 24-bpp DSI Video Packets with RGB666 and RGB888 Formats
- Suitable for 60-fps WUXGA 1920 × 1200 Resolution at 18-bpp and 24-bpp Color, and 60-fps 1366 × 768 Resolution at 18-bpp and 24-bpp
- Output Configurable for Single-Link or Dual-Link LVDS
- Supports Single-Channel DSI to Dual-Link LVDS Operating Mode
- LVDS Output-Clock Range of 25 MHz to 154 MHz in Dual-Link or Single-Link Mode
- LVDS Pixel Clock May be Sourced from Free-Running Continuous D-PHY Clock or External Reference Clock (REFCLK)
- 1.8 V Main VCC Power Supply
- Low Power Features Include SHUTDOWN Mode, Reduced LVDS Output Voltage Swing, Common Mode, and MIPI Ultra-Low Power State (ULPS) Support
- LVDS Channel SWAP, LVDS PIN Order Reverse Feature for Ease of PCB Routing
- Packaged in 64-pin 10 mm × 10 mm HTQFP (PAP) PowerPAD™ IC Package
The SN65DSI84-Q1 DSI-to-LVDS bridge features a single-channel MIPI D-PHY receiver front-end configuration with four lanes per channel operating at 1 Gbps per lane and a maximum input bandwidth of 4 Gbps. The bridge decodes MIPI® DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video data-stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a dual-link LVDS or single-link LVDS with four data lanes per link.
The SN65DSI84-Q1 device is well suited for WUXGA (1920 × 1080) at 60 frames per second (fps) with up to 24 bits-per-pixel (bpp). Partial line buffering is implemented to accommodate the data stream mismatch between the DSI and LVDS interfaces.
The SN65DSI84-Q1 device is implemented in a small outline 10 mm × 10 mm HTQFP package with a
0.5-mm pitch, and operates across a temperature range from –40°C to 105°C.
技術文件
設計與開發
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SN65DSI85Q1-EVM — 雙通道 MIPI® DSI 轉 Dual-Link FlatLink™ LVDS 橋接評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTQFP (PAP) | 64 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。