SN74LV4052A-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Supports mixed-mode voltage operation on all ports
- Fast switching
- High on-off output-voltage ratio
- Low crosstalk between switches
- Extremely low input current
These dual 4-channel CMOS analog multiplexers and demultiplexers are designed for 1.0V to 5.5V VCC operation.
The SN7LV4052A-Q1 devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5V (peak).
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
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檢視所有 5 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN74LV4052A-Q1 Automotive Dual 4-Channel Analog Multiplexers and Demultiplexers datasheet (Rev. J) | PDF | HTML | 2024年 10月 14日 |
| Functional safety information | SN74LV405xA-Q1 Functional Safety FIT Rate, FMD and Pin FMA | PDF | HTML | 2024年 8月 5日 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
| More literature | Automotive Logic Devices Brochure | 2014年 8月 27日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
介面轉接器
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
使用指南: PDF
參考設計
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
| SOT-23-THN (DYY) | 16 | Ultra Librarian |
| TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。