THS3095
- Low distortion:
- 84-dBc HD2 at 10 MHz, R L = 1 kΩ
- 99-dBc HD3 at 10 MHz, R L = 1 kΩ
- Low noise:
- 15-pA/√ Hz noninverting current noise
- 14-pA/√ Hz inverting current noise
- 1.1-nV/√ Hz voltage noise
- High slew rate: 6000 V/µs (G = 5, V O = 20 V PP)
- Wide bandwidth: 305 MHz (G = 2, R L = 100 Ω)
- High output current drive: ±310 mA
- Wide supply range: ±5 V to ±16 V
- Power-down feature: THS3095 only
The THS3091 and THS3095 (THS309x) are high-voltage, low-distortion, high-speed, current-feedback amplifiers that operate over a wide supply range of ±5 V to ±16 V. These devices are an excellent choice for applications that require large, linear output signals, such as pin drivers, power-FET drivers, and arbitrary waveform generators.
The THS3095 features a power-down pin ( PD) that puts the amplifier into a low-power standby mode, and lowers the quiescent current from 9.5 mA to 500 µA.
The wide, 32‑V supply range, 6000‑V/µs slew-rate, and 310‑mA output current drive make the THS309x an excellent choice for high-voltage arbitrary-waveform-driver applications. Moreover, with the ability to handle large voltage swings driving into low-resistance and high-capacitance loads while maintaining good settling time performance, these devices are an excellent choice for pin-driver and power-FET driver applications.
The THS309x are offered in an 8‑pin SOIC (DDA) PowerPAD™ integrated circuit package. The THS3091 is also offered in an 8‑pin HVSSOP (DGN) package.
技術文件
設計與開發
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THS3095EVM — 具有關機功能的 THS3095 評估模組,適用單路高電壓低失真運算放大器
THS3095 評估模組 (EVM) 提供評估 THS3095 高電壓、低失真、高速電流回饋放大器的平台。使用者只需電源、輸入訊號及測試儀器,即可操作 EVM。
應用領域:
- 高電壓任意波形
- 電源 FET 驅動器
- 接腳驅動器
- VDSL 線路驅動器
ANALOG-ENGINEER-CALC — 類比工程師計算機
VOLT-DIVIDER-CALC — Voltage divider calculation tool
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-01486 — 超音波流量發射器參考設計
TIDA-00075 — 高頻寬和高電壓任意波形產生器前端
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HSOIC (DDA) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點