TLV2382
- BiMOS Rail-to-Rail Input/Output
- Input Bias Current ...1 pA
- High Wide Bandwidth ...160 kHz
- High Slew Rate ...0.1 V/µs
- Supply Current ...7 µA (per channel)
- Input Noise Voltage ...90 nV/Hz
- Supply Voltage Range ...2.7 V to 16 V
- Specified Temperature Range
- -40°C to 125°C ...Industrial Grade
- Ultra-Small Packaging
- 5 Pin SOT-23 (TLV2381)
- APPLICATIONS
- Portable Medical
- Power Monitoring
- Low Power Security Detection Systems
- Smoke Detectors
The TLV238x single supply operational amplifiers provide rail-to-rail input and output capability. The TLV238x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range, while adding the rail-to-rail output swing feature. The TLV238x also provides 160-kHz bandwidth from only 7 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8 V supplies down to ±1.35 V) two rechargeable cells.
The combination of rail-to-rail inputs and outputs make them good upgrades for the TLC27Lx familyoffering more bandwidth at a lower quiescent current. The offset voltage is lower than the TLC27LxA variant.
To maintain cost effectiveness the TLV2381/2 are only available in the extended industrial temperature range. This means that one device can be used in a wide range of applications that include PDAs as well as automotive sensor interface.
All members are available in SOIC, with the singles in the small SOT-23 package, duals in the MSOP.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Family of Micro-Power Rail-to-Rail Input and Output Operational Amplifiers datasheet (Rev. A) | 2003年 2月 18日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | TLV2381, TLV2382 EMI Immunity Performance (Rev. A) | 2012年 11月 14日 | ||
Application note | TLV2381, TLV2382 EMI Immunity Performance | 2012年 9月 24日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
DUAL-DIYAMP-EVM — 雙通道通用自製 (DIY) 放大器電路評估模組
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點