TLV2452
- Supply Current...23 µA/Channel
- Gain-Bandwidth Product...220 kHz
- Output Drive Capability...±10 mA
- Input Offset Voltage...20 µV (typ)
- VDD Range...2.7 V to 6 V
- Power Supply Rejection Ratio...106 dB
- Ultralow-Power Shutdown Mode
IDD ...16 nA/ch - Rail-To-Rail Input/Output (RRIO)
- Ultrasmall Packaging
- 5 or 6 Pin SOT-23 (TLV2450/1)
- 8 or 10 Pin MSOP (TLV2452/3)
The TLV245x is a family of rail-to-rail input/output operational amplifiers that sets a new performance point for supply current and ac performance. These devices consume a mere 23 µA/channel while offering 220 kHz of gain-bandwidth product, much higher than competitive devices with similar supply current levels. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower rail-to-rail input/output operational amplifiers. The TLV245x can swing to within 250 mV of each supply rail while driving a 2.5-mA load. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV245x family ideal for portable medical equipment, patient monitoring systems, and data acquisition circuits.
Three members of the family (TLV2450/3/5) offer a shutdown terminal for conserving battery life in portable applications. During shutdown, the outputs are placed in a high-impedance state and the amplifier consumes only 16 nA/channel. The family is fully specified at 3 V and 5 V across an expanded industrial temperature range (40°C to 125°C). The singles and duals are available in the SOT23 and MSOP packages, while the quads are available in TSSOP. The TLV2450 offers an amplifier with shutdown functionality all in a 6-pin SOT23 package, making it perfect for high density circuits.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV245x, TLV245xA: 23-uA 220-KHz Rail-to-Rail Input/Output Op Amps With Shutdown datasheet (Rev. F) | 2005年 1月 19日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 1999年 12月 22日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 與 SOT23-6)
- DCK(SC70-5 與 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
DUAL-DIYAMP-EVM — 雙通道通用自製 (DIY) 放大器電路評估模組
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點