現在提供此產品的更新版本
功能相同,但引腳輸出與所比較的裝置不同
TLV2460A-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C6
- ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model C = 200 pF, R = 0) - Rail-to-Rail Output Swing
- Gain Bandwidth Product: 6.4 MHz
- Output Drive Capability: ±80-mA
- Supply Current: 500 µA/Channel
- Input Noise Voltage: 11 nV/√Hz
- Slew Rate: 1.6 V/µs
- Micropower Shutdown Mode (TLV2460-Q1 and TLV2463-Q1): 0.3 µA/Channel
- Universal Operational Amplifier EVM
- Available in Single, Dual, and Quad Versions
The devices in the TLV246x-Q1 family of low-power rail-to-rail input/output operational amplifiers are designed for battery management systems in HEV/EV and Powertrain, and lighting and roof module systems in body and lighting applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x-Q1 designed for buffering analog-to-digital converters.
The operational amplifier has 6.4-MHz bandwidth and a 1.6-V/µs slew rate with only 500-µA supply current, which provides good ac performance with low-power consumption. Devices are available with an optional shutdown terminal, which places the amplifier in an ultra-low supply-current mode (IDD = 0.3 µA per channel). While in shutdown, the operational amplifier output is placed in a high-impedance state. DC applications are designed with an input noise voltage of 11 nV/√Hz and input offset voltage of 100 µV.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV246xx-Q1 Low-Power Rail-to-Rail Input/Output Operational Amplifiers With Shutdown datasheet (Rev. G) | PDF | HTML | 2018年 2月 21日 |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點