現在提供此產品的更新版本
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
TLV6002-Q1
- AEC-Q100 Qualified for Automotive Applications
- Device Temperature Grade 1: –40°C to +125°C, TA
- Device HBM ESD Classification Level 3A
- Device CDM ESD Classification Level C6
- General-Purpose Amplifiers for Cost-Sensitive Systems
- Supply Range: 1.8 V to 5.5 V
- Gain Bandwidth: 1 MHz
- Low Quiescent Current: 75 µA/ch
- Rail-to-Rail Input and Output
- Low Offset Voltage: 0.75 mV
- Unity-Gain Stable
- Input Voltage Noise Density: 28 nV/√Hz at 1 kHz
- Internal RF and EMI Filter
- Extended Temperature Range:
–40°C to 125°C
The TLV600x-Q1 family of single and dual-channel operational amplifiers is specifically designed for general-purpose automotive applications. Featuring rail-to-rail input and output (RRIO) swings, low quiescent current (75 µA, typical), wide bandwidth (1 MHz) and low noise (28 nV/√Hz at 1 kHz), this family is attractive for a variety of automotive applications that require a good balance between cost and performance, such as infotainment, engine control units, and automotive lighting. The low-input-bias current (±1 pA, typical) enables the TLV600x-Q1 to be used in applications with megaohm source impedances.
The robust design of the TLV600x-Q1 provides ease-of use to the circuit designer: unity-gain stability with capacitive loads of up to 150 pF, integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).
The devices are optimized for operation at voltages as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended temperature range of –40°C to +125°C.
The single-channel TLV6001-Q1 is available in the SC70-5 package, and the dual-channel TLV6002-Q1 is available in both SOIC and VSSOP packages.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV600x-Q1 Low-Power, Rail-to-Rail In/Out, 1-MHz Operational Amplifier for Cost-Sensitive Systems datasheet (Rev. A) | PDF | HTML | 2018年 12月 13日 |
Functional safety information | TLV600x-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2022年 12月 19日 | |
E-book | An Engineer’s Guide to Designing with Precision Amplifiers | 2021年 4月 29日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 與 SOT23-6)
- DCK(SC70-5 與 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
DUAL-DIYAMP-EVM — 雙通道通用自製 (DIY) 放大器電路評估模組
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點