TLV9104-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to +125°C, TA
- Rail-to-rail input and output
- Wide bandwidth: 1.1MHz GBW
- Low quiescent current: 120µA per amplifier
- Low offset voltage: ±300µV
- Low offset voltage drift: ±0.6µV/°C
- Low noise: 28nV/√Hz at 10kHz
- High common-mode rejection: 110dB
- Low bias current: ±10pA
- High slew rate: 4.5V/µs
- Wide supply: ±1.35V to ±8V, 2.7V to 16V
- Robust EMIRR performance: 77dB at 1.8GHz
The TLV910x-Q1 family (TLV9101-Q1, TLV9102-Q1, and TLV9104-Q1) is a family of 16V general purpose operational amplifiers. This family offers excellent DC precision and AC performance, including rail-to-rail input/output, low offset (±300µV, typical), low offset drift (±0.6µV/°C, typical), and 1.1MHz bandwidth.
Wide differential and common-mode input-voltage range, high output current (±80mA, typical), high slew rate (4.5V/µs, typical), and low power operation (115µA, typical)make the TLV910x-Q1 a robust, low-power, high-performance operational amplifier for automotive applications.
The TLV910x-Q1 family of op amps is available in several packages, and is specified from –40°C to 125°C.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
DUAL-DIYAMP-EVM — 雙通道通用自製 (DIY) 放大器電路評估模組
TLV910x and TLV910x-Q1 TINA-TI Reference Design (Rev. A)
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點