TMP302
- Low Power: 15 µA (Maximum)
- SOT563 Package: 1.6-mm × 1.6-mm × 0.6 mm
- Trip-Point Accuracy: ±0.2°C (Typical) From +40°C to +125°C
- Pin-Selectable Trip Points
- Open-Drain Output
- Pin-Selectable Hysteresis: 5°C and 10°C
- Low Supply Voltage Range: 1.4 V to 3.6 V
The TMP302 device is a temperature switch in a micropackage (SOT563). The TMP302 offers low power (15-µA maximum) and ease-of-use through pin-selectable trip points and hysteresis.
These devices require no additional components for operation; they can function independent of microprocessors or microcontrollers.
The TMP302 is available in several different versions. For additional trip points, contact a TI representative.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TMP302 Easy-to-Use, Low-Power, Low-Supply Temperature Switch in Micropackage datasheet (Rev. E) | PDF | HTML | 2018年 12月 21日 |
Application brief | Improving System Reliability in Auto and Ind. Cameras w/ AccurateTemp. Sensing | PDF | HTML | 2022年 1月 3日 | |
E-book | E-book: An engineer’s guide to industrial robot designs | 2020年 2月 12日 | ||
Application brief | How to Protect Control Systems From Thermal Damage (Rev. A) | 2019年 1月 9日 | ||
Technical article | A key to accurate system thermal management: monitoring both current flow and temp | PDF | HTML | 2018年 10月 4日 | |
Technical article | How to maintain thermal performance when designing with USB Power Delivery | PDF | HTML | 2017年 6月 12日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-5X3 (DRL) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點