TMUX1136
- Wide supply range: 1.08V to 5.5V
- Low leakage current: 3pA
- Low on-resistance: 2Ω
- Low charge injection: –6pC
- -40°C to +125°C operating temperature
- 1.8V logic compatible
- Fail-safe logic
- Rail-to-rail operation
- Bidirectional signal path
- Break-before-make switching
- ESD protection HBM: 2000V
The TMUX1136 is a complementary metal-oxide semiconductor (CMOS) single-pole double-throw (2:1) switch with two independently controlled channels. A wide operating supply of 1.08V to 5.5V makes this device an excellent choice for a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD. All logic inputs have 1.8V logic compatible thresholds, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX1136 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 3nA and small package options enable use in portable applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TMUX1136 5V Low-Leakage-Current, 2:1, 2-Channel Precision Analog Switch datasheet (Rev. B) | PDF | HTML | 2024年 2月 2日 |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application brief | Improving Pulse Oximeter Solution Performance without Sacrificing Size (Rev. A) | PDF | HTML | 2021年 4月 26日 | |
Application note | Choosing the Right Multiplexer for MCU Expansion | PDF | HTML | 2020年 11月 19日 |
設計與開發
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
USON (DQA) | 10 | Ultra Librarian |
VSSOP (DGS) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。